Apple iPad 4 – A6X Tear-down

Chipwork's teardown of the new Apple iPad 4 reveals a major redesign of the graphic processor (GPU). The much larger area dedicated to the GPU and wider interface of the DRAM improves the display and touch screen performance of the iPad 4. It probably also helps prolong battery life.


" The A6 is 94mm2 while the A6X is 123mm2 – a full 30% larger.So where did that extra area go? Well, firstly, it did not go to the CPU core. The A6X uses the identical CPU to the A6. Same size, same layout. This is not surprising given that the prior CPU used custom layout techniques, and therefore it would be a huge amount of work to redesign so soon. Much of the extra area has gone to the GPU cores which are up from 3 to 4. More notable is that each of these GPU cores is much larger.On the A6X each GPU core is 8.7mm2 while the A6 GPU cores are only 5.4mm2. The overall area occupied by the A6X GPU cores is more than double that of the A6!

So we see that of the 29 mm2 of new area on the A6X, a full 18.6 mm2 is the result of the increased quantity of graphics processing. Impressive!

Additionally, if you look closely at the GPU cores (which our high magnification scopes allow us to do), we can see they are actually split into sub-cores themselves. Each GPU core is sub-divided into 9 sub-cores (2 sets of 4 identical sub-cores plus a central core). This could be done to allow for more efficient parallel processing, or to allow for a higher maximum clock rate. In either case, these GPUs should result in some blazing graphics on your iPad.

Other items of note:

It looks like the A6X has double the SDRAM interface width of the A6 (again likely to allow for greater graphics processing power).

Other than the CPU, it appears all the other digital cores have new layouts. This chip is not just a minor tweak from the A6, a lot of work has gone into this.

Apple has reduced the number of core PLLs needed from 9 on the A6 to 8 on the A6X. However they have moved them close to the middle of the chip which may allow for better control over clock skew across the chip.

Many of the analog and interface cores have been reused from the A6, however there are also some new interface blocks."

Additional information

Ron Maltiel   www.maltiel-consulting.com

3D Flash NAND Devices and Process

The article below discusses developments in 3D Flash NAND. Toshiba and Macronix have different approaches. See more details about Toshiba Next NAND- 3D with 15 Layers.


Applied material discusses processing issues and new equipment to address them.

"According to Applied Materials, building 3D NAND structures in like trying to dig a one-kilometer-deep, three-kilometer-long trench with walls exactly three meters apart, through interleaved rock strata."

Ron Maltiel
www.maltiel-consulting.com





3D NAND flash is coming

http://www.edn.com/electronics-blogs/practical-chip-design/4401542/3D-NAND-flash-is-coming

Brian Bailey - November 15, 2012

Flash memory has very quickly risen from being an obscure memory type to perhaps becoming the dominant memory type for many devices, including music players, cell phones, tablets and now increasingly servers and mainstream PCs. But flash memory does not scale quite as well as the more traditional DRAM that it is replacing. It is thought that DRAM can scale down to 1nm whereas we are already hitting some problems with the scaling of the floating gate in NAND flash. It is not thought that planar NAND can go below 10nm which is only a couple of processes steps away from where we are today.


There are several other types of memory being developed, including spin-torque MRAM and Resistive RAM (ReRAM) that may replace both RAM and flash in the future. Another exciting direction is 3D NAND structures. In some respects this is similar to FinFET development for traditional transistors that are finding their way into 20nm and 14nm processes.


Toshiba is one company pushing 3D NAND processes with its p-BiCS (pipe-shaped Bit Cost Scalable) technology. The thought is that rather than lay the cells flat on the surface, higher densities can be achieved by stacking them on top of each other. This is shown diagrammatically in the figure below. As you can see this is not the same as 3D ICs where multiple substrates are layered on top of each other and connected using through silicon vias (TSV), this is building cells on top of each other to create U shaped bit lines. They currently have 16 layers devices where the hole size is 50nm and Toshiba says that the process becomes cheaper than the traditional NAND processes when more than 15 layers are created. Samples are expected next year and volume shipments by 2015...
  Additional details

Preview of 2013 ISSCC

ISSCC Full program

Some highlights from the upcoming ISSCC 2013



1. Revving ReRAMS, boosting memory bandwidth

2. Samsung big.little, but no Intel, Nvidia CPUs










ISSCC preview: Revving ReRAMS, boosting memory bandwidth

Brian Fuller 11/19/2012 9:05 AM EST

http://eetimes.com/electronics-news/4401652/ISSCC-preview--Revving-ReRAMS--boosting-memory-bandwidth

SAN FRANCISCO--Relentless scaling advances will highlight memory papers at February's International Solid State Circuits Conference here, but it may be break-throughs in off-beat memory architectures that raise a few eyebrows.
ISSCC, scheduled for Feb. 17-21, 2013 at the Marriott, features a slightly smaller percentage of memory papers than usual for the five-day affair (9 percent of the total is down from 10 percent this year and 10 pecent in 2011), but the topics are no less fascinating.

Memory subcommittee chair Kevin Zhang of Intel notes in his memory overview, "We continue to see progressive scaling in embedded SRAM, DRAM, and floating-gate based Flash for very broad applications. However, due to the major scaling challenges in all mainstream memory technologies, we see a continued increase in the use of smart algorithms and error-correction techniques to compensate for increased device variability."
Revving ReRAM


One of the standout papers for the memory sessions comes from Toshiba and Sandisk, who will describe a 32Gb ReRAM (Resistive random-access memory) test chip developed in 24nm process, with a diode as the selection device.

The allure of alternative non-volatile memories has been high cycling capability and lower power per bit in read/write but their densities don't compete with NAND flash. ISSCC organizers noted that the highest density for a single chip published at last year’s ISSCC is 64Mb for ReRAM and 8Gb for PRAM, while NAND can reach up to 128Gb.

The Sandisk-Toshiba test chip is a metal-oxide-based ReRAM is based on 24nm technology node with a diode as the selection device and a 2-layered architecture.....

2. Samsung big.little, but no Intel, Nvidia CPUs
Samsung will describe the first mobile applications processor to use ARM’s big.little concept....

Additional information

Ron Maltiel
www.maltiel-consulting.com

Samsung Advances Memory Storage eMMC to 1x-nm Process

Samsung unveiled a 64 gigabytes (GB) embedded multimedia card(eMMC) based on 10 nanometer (nm)process technology (see below). Earlier in August Samsung started "volume production of 128-gigabyte (GB) embedded NAND for next-generation smartphones, tablets and other mobile devices, the company said Wednesday (Sept. 19). Samsung began production of the 128-GB embedded multimedia card (eMMC) Pro Class 1500 NAND in late August"




While the announcement of 10nm flash NAND is an important step, this is just an initial step in ramping up the process in the 1xx nm process. We should keep in mind that definition of 10nm class process is a bit loose. It probably just means that it uses a process in the 1x-nanometer class
Ron Maltiel


http://www.maltiel-consulting.com/





Additional information

Samsung Advances Memory Storage For Slim Smartphones & Tablets

Qualcomm, Globalfoundries +30% in Sales in 2012

Fabless chip manufacturer Qualcomm and foundry vendor Globalfoundries are each expected to move up IC Insights Inc.'s list of the top 20 chip vendors as ranked by sales in 2012 (see tables below.)





Both are benefitting from growth of mobile and tablet chip demands. Samsung is likely to lose sales due to Apple shifting production away from them. See more about foundaries ranking in 2011 and 2012.




Ron
www.maltiel-consulting.com






Qualcomm, Globalfoundries gain in chip sales rankings

Dylan McGrath

11/8/2012 2:02 AM EST

Fabless giant, foundry forecast to climb to top 20 rankings ladder by growing sales by 30 percent in 2012. SAN FRANCISCO—Fabless chip giant Qualcomm Inc. and foundry vendor Globalfoundries Inc. are each expected to move up IC Insights Inc.'s list of the top 20 chip vendors as ranked by sales in 2012, according to the market research firm's latest forecast.

Both firms are expected to grow sales by at least 30 percent, according to IC Insights (Scottsdale, Ariz.). Qualcomm (San Diego) is on pace for 2012 revenue of more than $12.8 billion, fourth among all chip firms, up from seventh in 2011, according to the November Update to IC Insight's McClean Report. Meanwhile, Globalfoundries (Milpitas, Calif.) is on pace to move to No. 15 this year from No. 21 last year, with projected sales of $4.56 billion, according to the report.  

Additional information

FinFET Layout Design Rules and Variability

It is not simple to design circuits with FinFET transistors. Layout, 3D dimensions, and shape considerations are described in the article below. Some additional information about Intel's 22nm 3D Tri-Gate FinFETs Transistors.








Ron
http://www.maltiel-consulting.com/



FinFET structure design and variability analysis enabled by TCAD

Victor Moroz, Synopsys Inc.

10/8/2012 10:14 AM EDT

The introduction by Intel of FinFET transistors at the 22nm mode culminates many years of research and development of a replacement transistor to the immensely successful planar MOSFET whose progressive miniaturization is largely responsible for the electronics revolution. The need for a successor to the planar MOSFET had long ago been identified. Starting with the 90nm process node, improved transistor performance was achieved with the introduction of stress into the transistor channel in a way that boosts the speed of the electrons and holes traveling within it. However, controlling the transistor leakage in the off-state became progressively more difficult. Keeping the electrons and holes under the electrostatic control of the gate electrode is key to controlling leakage current, but a number of so-called short channel effects undermine the gate control. The introduction of high-k dielectrics as the gate insulator at the 45nm process node effectively extended the life of the planar MOSFET for another two process nodes, but by the 22nm process node the planar MOSFET could hardly offer an attractive balance of performance and leakage.


Intel’s FinFETs thus mark the first fundamental change in transistor architecture since the time when the MOSFET replaced the bipolar transistor as the transistor of choice for logic applications. Its performance improvements over the preceding process node (see table) are a clear indication of the promise this technology holds. Although the manufacturing of FinFETs is more complex than manufacturing of its planar predecessor, Intel’s introduction is a testament to the inevitability of these devices....   More at FinFET Layout Design and Variability

IEDM 2012 Preview: 20nm and Smaller

Some of the key issues in the upcoming IDEM 2012 are discussed in "Intel, rivals gird for IC manufacturing showdown" and in "IEDM preview: 20nm and below" .




"There have been three primary drivers in the semiconductor industry for the last four decades: Area, power/performance and cost. The well-known push to cram more functionality onto a single chip through continued scaling -- or into a single package through 3D integration and other advanced packaging techniques -- has been well documented. Today, with the exception of Intel, the industry's leading edge devices in high volume manufacturing have critical dimensions of 28nm. Intel, racing ahead, introduced the 22nm IvyBridge chip in 2011 and has announced plans to have 14nm by the end of 2013. How long this kind of scaling can continue is the subject of some debate, with most recognizing the EUV lithography will be required at some point, most likely for the 10nm generation (Intel has said it doesn't need it for 14nm).

It's clear, though, that continued scaling is running out of steam..."   Ron   www.maltiel-consulting.com

Inside Microsoft Surface and Amazon Kindle Fire HD

"One big winner with the Surface appears to be Samsung. With one key exception —building the main processor chips —Samsung has been pushed out of Apple's iPad and iPhone products. For the Surface, Samsung supplied the display, the memory chips and the battery, amounting to about $137, or about half of the $271 bill-of-materials (BOM) cost."

Ron
http://www.maltiel-consulting.com/





Two More Teardowns Look Inside Microsoft Surface and Amazon Kindle Fire HD
Arik Hesseldahl  November 6


You have to credit the folks over at research firm IHS, because, apparently, they’ve pulling a little bit of overtime. Along with the teardown of Apple’s iPad mini, the results of which they sent to AllThingsD yesterday, they also included their first looks inside Microsoft’s Surface and Amazon’s seven-inch Kindle Fire HD.


Let’s get to the Surface first. (That’s a picture of it taken apart, at right.) With a base price of $499 for a 32 gigabyte Surface without the Touch Cover accessory, IHS estimates that the cost of components used to build it amount to $271 for a starter 32GB model, without the cover. The main components include a Tegra 3 processor chip from Nvidia, and a display and memory chips from Samsung. (Of course, Microsoft is probably buying memory chips from more than one vendor.)

Analyst Andrew Rassweiler, who led the IHS teardown team, said that Microsoft is using the relatively low entry price as a base, in hope of enticing consumers to buy higher-end models with the Touch Cover and higher memory capacity. The Touch Cover, which my colleague Walt Mossberg liked in his review of the Surface, costs $120 when purchased separately, and is bundled with the higher-end models.

Rassweiler estimates the cost of the parts used to build the Touch Cover at about $16, making it appear to be pretty profitable. It contains chips from Atmel and Freescale Semiconductor, he says. “It’s a compelling accessory for users to have, and a great example of a way in which manufacturers get consumers interested with a base price, and hope they’ll impulsively opt for extra features that make more profit,” he told me. Accessories always have higher profit margins than the devices they are intended to be sold with, Rassweiler says, and protective cases for phones and tablets always tend to sell well.

One big winner with the Surface appears to be Samsung. With one key exception — building the main processor chips — Samsung has been pushed out of Apple’s iPad and iPhone products. For the Surface, Samsung supplied the display, the memory chips and the battery, amounting to about $137, or about half of the $271 bill-of-materials (BOM) cost.

Now, on to the Kindle Fire HD. (Seen in its exploded view at right; click to make bigger.) Recall that the last Kindle Fire to get the teardown treatment came in with a cost estimate of $202 (later revised down to about $187) against a retail price of $199, meaning that Amazon was close or near to losing money on the hardware, and was hoping to make it back on the sale of content from its digital store, and even on sales of physical goods from its retail store. One estimate earlier this year suggested that Amazon makes more than $100 off each Kindle Fire. It’s probably pretty close to breakeven, if slightly profitable this time around, Rassweiler told me. Amazon CEO Jeff Bezos has said the devices are sold at cost.

Like the old one, the new Kindle Fire HD sells for a starting price of $199, and carries a combined cost of components of $165, according to IHS estimates. Key suppliers are LG Display, which made the screen; Texas Instruments, which repeated its role as the supplier of the main processing chip, plus power and video chips; and Samsung, which provided the memory.

Intel's 14nm Process and Manufacturing Roadmap

With foundaries venturing into the FinFET devices it is interesting to see Intel's direction.


The article below with Mark Bohr, senior fellow at Intel, review the road map pertaining to a wide range of manufacturing and design issues. Some of the key points in the article are:

* Intel is sticking with bulk CMOS instead of SOI.

* FinFET transitors are scalable to 14nm process.

* "3D stacked die have advantages, but only for certain market segments. You have to be very clear about what problem and what market segment you’re trying to serve. For a small handheld application where a small footprint and form factor are key and power levels are low, it probably makes good sense to use 3D stacking. For desktop, laptop and server applications where form factor isn’t as valuable and power levels are higher, 3D stacking has some problems that make it not an ideal solution"

Additional information about Intel's 22nm at Tutorial: Intel 22nm 3D Tri-Gate FinFETs Transistors and at Intel’s 22-nm Tri-gate Transistors Exposed


Ron
http://www.maltiel-consulting.com/



Deep Inside Intel
By Ed Sperling

Semiconductor Manufacturing & Design sat down with Mark Bohr, senior fellow at Intel, to talk about a wide range of manufacturing and design issues Intel is wrestling with at advanced nodes—and just how far the road map now extends.


SMD: Will EUV make 10nm? And if it doesn’t, what effect will that have on Intel?

Bohr: For a process module as critical as lithography, Intel always has more than one option we pursue. In this era, the options are either EUV or 193nm immersion with multi-patterning.


SMD: How about directed self-assembly?

Bohr: That’s not a universally usable approach. You still need to define some layers with direct patterning, not a self-assembly technique. That’s a niche direction that will not replace these mainstream lithography techniques, but there may be some layers where it can complement the normal patterning techniques.


SMD: What’s your opinion about the future of the foundry business?

Bohr: The traditional foundry model is running into problems. In order to survive, the foundries will have to become more like an integrated device manufacturer. Even some of the chief spokespeople for the foundries have said something similar. The foundry model worked well when traditional scaling was being followed and everybody knew where we were headed. In this era, where you continually have to invent new materials and new structures, it’s a lot tougher being a separate foundry and maskless design house. Being an IDM, we have design and process development under one roof. That’s really a significant advantage.


SMD: Can even Intel afford to be an independent IDM? The cost of building state-of-the-art fabs at future nodes is astronomical.

Bohr: Yes. We have the volume and the products that can fill multiple fabs.


SMD: But you’ve also opened up your fabs to at least a couple customers. Are you planning on extending that? ,

Bohr: Our motivation is that we know we have great process technology, and partnering with other strategic companies can be a win-win situation. We can sell our technology and make more money off what we’ve developed, and they can have some very compelling products. It’s not Intel’s goal to be a general-purpose foundry, but we will be partnering where it makes strategic sense.


SMD: Is Intel sticking to bulk CMOS or will move to new materials such as fully depleted SOI?

Bohr: We see more advantages in bulk than SOI. I won’t say SOI won’t be in the future. There may be some device structure that is better done in SOI than bulk. But I don’t see than happening right now. When we first announced that we were making TriGate or finFET devices at 22nm, we said we’re making these devices on SOI, as well. But we think there are cost advantages to doing TriGate on bulk rather than SOI. That’s our plan for the foreseeable future.


SMD: What comes after the current finFET?

Bohr: The finFET is scalable to 14nm.


SMD: But if you’re at 22nm, 14nm isn’t very far away, so you’ve got to be working on the next step.

Bohr: For Intel, you’re right. For other companies, it’s many years away. For 10nm, which is where I’m spending most of my time these days, I know we have a solution. I can’t elaborate at this point.


SMD: At 10nm aren’t you running into quantum effects?

Bohr: Everything gets different and tougher, but the problems are solvable—at least at that generation.


SMD: How far ahead can you see?

Bohr: I know we can get to 10nm. Beyond that, our research group is working on solutions for 7nm and 5nm. I have confidence we’ll have solutions for those. But by the time we’re down to 5nm we’ll be looking at non-familiar devices and device structures. That’s what we’ll have to do to get down to that level.


SMD: Where do stacked die fit into your roadmap?

Bohr: 3D stacked die have advantages, but only for certain market segments. You have to be very clear about what problem and what market segment you’re trying to serve. For a small handheld application where a small footprint and form factor are key and power levels are low, it probably makes good sense to use 3D stacking. For desktop, laptop and server applications where form factor isn’t as valuable and power levels are higher, 3D stacking has some problems that make it not an ideal solution.


SMD: Along those lines, does Intel see the smart phone and small mobile device market as a key direction?

Bohr: Intel is very serious about getting into the smart phone and tablet markets. We are a very different company from what we were five or six years ago. We are developing process technologies, but also products, that span a much wider range of performance and power than anywhere in our history. We’re not just after the high-performance desktop. We’re developing products that support 100-watt server chips down to sub-1 watt smart phone chips.


SMD: There are a number of interesting techniques Intel is working with, such as near-threshold computing. How will power management start changing inside these chips?

Bohr: When you’re talking about developing a smart phone chip that is ultra low power that also provides improved performance features that the market expects, you have to pull every trick out of the bag. You need great transistor technology, great package technology, great CPU architectures, the ability to turn off parts of the chip when you don’t need them so you’re saving power, the software links with the chip design so the software knows when to throttle power down. You need transistors, CPU architecture and software to be effective in that space.


SMD: How many cores will be required in the future?

Bohr: It depends on the market. In the server market, the more cores you can pack on the better. But in desktops, laptops and smart phones, there’s probably a limit to how many cores are practical. It’s not one. It’s probably several.


SMD: But less than eight?

Bohr: Yes, probably less than eight. But when you talk about the number of cores and computing engines, it depends on whether you’re dealing with traditional computing tasks where four cores are better than two cores. If you’re talking about execution engines in a graphics processor, clearly you want more cores.


SMD: What does this do for Intel’s platform strategy, particularly as you go after many markets with very specific needs?

Bohr: Even for Intel there are probably an optimal number of chip designs. It’s not like in the past where we tried to make one size fit all or have one chip serve multiple markets. But on the other hand, trying to design and manufacture dozens of very different designs in a generation is also impractical. There’s an optimal number of designs, although I don’t know what that number is, that can best meet the market requirements. You want to make as few iterations between the different designs as you can or re-use the cores or some of the circuit blocks between the different chips so you’re not completely redesigning it.


SMD: Are there other materials being considered for transistors?

Bohr: Our research group has been publishing papers about using 3-5 materials http://en.wikipedia.org/wiki/List_of_semiconductor_materials for the channels. You deposit indium phosphide or gallium arsenide layer on top of silicon to make a transistor on the surface. It’s still a silicon wafer, but you’re looking at depositing more exotic materials. That’s new and different and it may happen, but it’s not yet fully resolved how good that approach may be.


SMD: Has the priority for what you’re designing into a chip changed? Is it still all about performance, or has power overtaken that?

Bohr: Ten or 15 years ago, performance was the main goal in developing a new process technology. That really has gone away as the No. 1 priority. We still strive to provide a performance boost with each new technology, but there’s much more emphasis on improving power or efficiency on each new generation. We do that by reducing active power for the work a chip does. That’s a much more important goal for us today. Part of the reason is that the market has shifted from desktop applications to more mobile products. The first transition was from desktops to laptops. Now the move is to put things into smart phones. Today’s consumer wants computing power he can hold in his hand in the form factor of a smart phone and a tiny battery. He wants the performance he had on his laptop only three or four years ago. That’s what we shoot for.


SMD: That shifts the biggest challenge to the architecture, right?

Bohr: Yes. Whether it’s low-power, low-leakage transistors or a more efficient core architecture—or linking that with more efficient software.


SMD: What becomes the next big bottleneck?

Bohr: We have lots of challenges. Lithography is the key challenge in making transistors smaller. Whether EUV will happen on time or we have to extend immersion using multiple patterning. But when you make transistors smaller they don’t become less leaky. In fact, the opposite is true. You have to continually invent new structures and materials to allow feature-size scaling, which is critical for active power reduction and for cost.



SMD: But wires don’t scale well. How do you deal with that?

Bohr: RC delay gets worse as you scale, compared with transistors, which tend to get faster as you scale down. The industry has had 20-plus years of struggling with that problem. One way we’ve addressed that is that we’re no longer striving for very high operating frequency, especially in the phone market where 2 or 2.5GHz would probably be sufficient. That’s one advantage. The other advantage is that the average size of the chips is smaller in these laptop and cell phone applications so you don’t have interconnects traveling a long distance across a large chip. Instead, it’s a more compact chip so the signals don’t have to go as far. But even with those chips, we still have a challenge of performance from the interconnect. We have to be clever about what pitches we choose. Some of the lower layers are dense pitch, where density is important. Some of the upper layers are coarser pitch, where performance is important. We’re also continuing to drive down interconnect capacitance by employing lower-k dielectrics.


SMD: Is the interconnect becoming more problematic?

Bohr: If you talk to a designer 10 years ago you would have heard the same thing. Maybe now they’re saying, ‘This time we’re really serious.’


SMD: How about new interconnect technology?

Bohr: It’s hard to replace copper and low-k other than by making lower k. But at least in the low-power cell phone market, stacking chips does help to minimize some of the interconnect issues, particularly between the logic and the memory chips.


SMD: You’re referring to through-silicon vias?

Bohr: Yes.


SMD: So if Intel is planning to get into that market, the company is experimenting with that technology right now?

Bohr: Yes, and we’ve been public about exploring TSV and 3D technology for a couple years. Although there are some challenging technology aspects, the real issue is cost. Doing TSVs and stacking chips—especially these custom Wide I/O chips—is expensive. So this might be a better engineering solution in terms of density, performance and power, but will the market bear the added cost? Not all markets will bear the higher cost.

Apple's A6X Processor 32nm Process Advantages

Apple's latest iPad 4 processor comes with its latest processor: an A6X, which Apple says delivers twice the CPU and graphics performance as the A5X. See below some details about Apple's A6X processor.

"Apple moved from a 45nm process to a more power-efficient 32nm process. Instead of keeping performance the same and decreasing the iPad's thickness and weight, Apple instead chose to double its performance without sacrificing all-day battery life."

More about Apple's optimizing process and design at iPhone A6 Teardown Update

Ron
http://www.maltiel-consulting.com/






Deducing details about Apple's A6X processor


Apple promises double the CPU and graphics performance over the A5X, but how?

by Chris Foresman - Oct 23 2012, 3:25pm PDT


As usual, Apple didn't share many specifics about its new A6 "Extreme" (A6X) processor, which powers the fourth-generation iPad. However, by looking at Apple's claims that it's "twice as fast" as the A5X-powered third-gen iPad, it may be possible to deduce what's inside.

According to Apple, the A6X processor "delivers up to twice the CPU and graphics performance of the A5X chip." In other words, the dual-core CPU can process data twice as fast as the dual-core 1GHz, Cortex A9-based A5X. It can also churn through OpenGL triangles and textures at twice the rate of the PowerVR SGX543MP4 in the A5X. So how did Apple do that?

Looking at CPU power for the moment, we already know that Apple designed a custom ARM-based core for the A6. Running at 1.2GHz in the iPhone 5, two A6 cores run twice as fast as two 800MHz A5 cores in an iPhone 4S.

However, the A5X in the third-gen iPad was clocked at 1GHz. That means Apple is clocking the A6X higher yet. Given that architectural improvements account for some of the speed increase, Apple only had to clock the iPhone 5 at 150 percent to achieve double the compute performance of the iPhone 4S. With this in mind, we believe Apple is clocking the A6X's CPU cores at 1.5GHz.

Examining the GPU is slightly different. Apple already jammed four SGX543 GPU cores into the A5X in order to achieve performance parity with the two SGX543 GPU cores in the A5 chip that powers the iPad 2. The extra GPUs were needed just to keep up with the 2048×1532 pixel Retina display, so these did not offer any graphics performance improvement. However, Apple says that the A6X pumps pixels twice as fast.

Apple could be using a newer-generation PowerVR core, but that appears to be very unlikely. Only one announced processor is known to use a PowerVR Series6 design, and it won't even begin sampling until 2013. Given that Apple just released the A6 a month ago, we're confident Apple is still using the same SGX543 core.

Here's what we know about the PowerVR SGX543 core's performance: it scales almost linearly with the number of cores and clock speed. So to double the performance, Apple would either have to double the number of cores to eight or double the clock speed of each of the four cores. Apple says that the A6X has "quad-core graphics"—the same as the A5X—so Apple clearly boosted the clock speed. Since the GPUs in the A5X were clocked at 250MHz, we believe that Apple has clocked the SGX543 cores at 500MHz.

Given the significant boosts in clock frequency—150 percent for the CPU cores, and 200 percent for the GPU cores—you may be wondering how Apple can still promise a 10-hour battery life. After all, the iPad still has the exact same 42.5Whr battery, but the processor is twice as powerful. The power savings come from the same place as we saw in the iPhone—Apple moved from a 45nm process to a more power-efficient 32nm process. Instead of keeping performance the same and decreasing the iPad's thickness and weight, Apple instead chose to double its performance without sacrificing all-day battery life.

Of course, we won't know how accurate our educated guesses are until one of the new iPads can be thoroughly benched, and the A6X's architecture is analyzed by the likes of Chipworks. However, we feel confident suggesting Apple has mated two A6 ARM cores running at 1.5GHz with four PowerVR SGX543 cores running at 500MHz. Given the performance results we saw with the iPhone 5, we expect the updated iPad will remain at the top of the tablet performance heap for some time.

Microsoft Surface TearDown

"Prominent ICs chips on the Surface motherboard: 

• Purplish-Blue (R26, G48, B231; #1a30e7): Marvell 88W8797-BMP2 wireless MIMO SoC

• Greenish-Yellow (R228, G230, B74; #e4e64a): Micron 2RE22 D9QBJ 2 GB DDR3 SDRAM

• Greyish-Red (R163, G50, B25; #a33219): Nvidia quad-core 1.4GHz Tegra 3 ARM-based microprocessor

• Bluish-Green (R97, G171, B162; #61aba2): Texas Instruments TPS659110 power management IC

• Brownish-Orange (R198, G112, B36; #c67024): Samsung KLMBG4GE4A eMMC 32GB NAND Flash

• Pale Violet with a Trace of Mauve (R181, G92, B227; #b55ce3): Wolfson 8962E ultra low power stereo audio codec

• Cypress Semiconductor CY8C20466A capacitive touchscreen controller
• Atmel MXT1386 touchscreen controller
• M430 G2402
• 1600P E284A " (from iFixIt's and theregistry.co.uk)

 more at Latest Microsoft Surface TearDown




Ron Maltiel

http://www.maltiel-consulting.com/

  

 

 

Microsoft Surface Teardown

We got our hands on Microsoft's new Surface, and to its credit, it lasted a good twenty minutes before we decided to tear it open.

 

Step 1 — Microsoft Surface Teardown 

Is that the display assembly from a PC laptop? Nope, it's the new Microsoft Surface with Windows RT.

Notable tech specs:

•  0.6" ClearType HD Display (resolution of 1366x768 pixels)
• Quad-core NVIDIA Tegra 3 processor
• 2 GB RAM
• 32 or 64 GB flash storage
• Wi-Fi (802.11a/b/g/n) + Bluetooth 4.0
• 720p HD Front and Rear facing LifeCams

 

 

To give the Surface laptop-like connectivity, nearly every edge includes ports and buttons. They are (from left to right):

 

Magnetic charging, USB 2.0, and Micro-HDMI out on the right side

 Magnetic connection for the Touch Cover or Type Cover on the bottom

 Headphone jack and volume rocker on the left side 

Mobile DRAM Takes Over

"mobile DRAM commanded more than 26 percent of all DRAM revenue during the second quarter—a significant improvement from 19 percent the same time a year ago, and from 11 percent two years ago in 2010.
This is attributed to 2 reasons:
1. Share of mobile DRAM bit shipments is now at 17.8 percent, up from 7.9 percent in the first quarter.
2. The price of mobile DRAM has fallen less than that of its commodity cousin and its pricing is overall less vulnerable given the segments it plays in."(from Mobile DRAM Market Grows, Samsung Domination Continues)

Ron
www.maltiel-consulting.com



Mobile DRAM revenues up in 2nd Quarter

Thursday, October 18, 2012


Mobile DRAM revenues rose to the highest level yet in the second quarter of 2012 Revenues amounted to US$1.85 billion in the second quarter, up from US$1.83 billion in the first.

Two reasons account for mobile DRAM's rising market clout. First, mobile DRAM's share of total DRAM bit shipments is now at 17.8%, up from 7.9% in the first quarter.

Second, the price of mobile DRAM has fallen less than that of itsd cousin, commodity DRAM, IHS noted. While commodity DRAM historically has been subject to great swings in pricing—with the product losing as much as half of its value from the second to the fourth quarter last year alone—mobile DRAM pricing is less vulnerable, falling 10% per quarter on average.

Mobile DRAM also tends to be priced according to manufacturing cost, not based on the general balance between supply and demand. As a result, DRAM companies are able to earn a more reasonable margin for their mobile memory products—unlike in commodity DRAM, where negative margins are frequently the rule.

Samsung Electronics continued its unshakable hold at the top of the mobile DRAM market in the second quarter of 2012, with sales of US$1.1 billion, or a remarkable 61% of the global mobile DRAM market.

With the success of smartphones such as the Galaxy S3, the South Korean electronics titan also is now one of the world's largest consumers of mobile DRAM. Samsung enjoyed a 3% improvement in sales during the quarter, and its year-to-year growth was even more impressive at 35%.

SK Hynix was No. 2 behind Samsung with sales of US$362 million, down from US$366 million in the first quarter and from US$377 million the same time a year ago.

Elpida Memory snagged a 13% share based on mobile DRAM revenues of US$245 million in the second quarter of 2012, while Micron Technology saw its share amount to 4% in light of US$79 million in revenues.
By: DocMemory

DOJ investigating Samsung's patent licensing strategies

Wilmer Exposes DOJ Probe Into Samsung Patent Licensing

The Litigation Daily

Jan Wolfe 10-25-2012

The epic patent fight between Apple Inc. and Samsung Electronics Co. Ltd. took another unusual turn on Tuesday, when Apple's lawyers at Wilmer Cutler Pickering Hale and Dorr broke the apparent news that the U.S. Department of Justice is investigating Samsung's patent licensing strategies.

Apple wrote in a motion filed at the U.S. International Trade Commission that the DOJ is investigating whether Samsung is using "standards-essential" patents anticompetitively. (The probe hasn't been verified, but Apple is unlikely to be making it up.) The motion concerns whether an import ban on certain Apple devices, including the iPhone and iPad, would be in the public interest. Apple's lawyers at Wilmer argue that Samsung can't ask for an import ban because it broke a promise to license patents on fair, reasonable, and nondiscriminatory (FRAND) terms. [Hat tip: FOSS Patents blogger Florian Muller.]

Samsung sued Apple at the ITC in June 2011, alleging infringement of five FRAND patents. Before filing suit, Samsung had offered to license some of the FRAND patents to Apple in exchange for 2.4 percent of Apple's sales--a steep royalty. Apple argued in its defense that the patents are unenforceable because Samsung's licensing demands were abusive and anticompetitive.

Samsung voluntarily dropped its claims over one of the patents, and then on Sept. 14 an ITC administrative law judge ruled that Apple didn't infringe the four that remained. The ruling was somewhat of a blow to Apple, however, in that the ALJ declined to find that the patents were unenforceable due to FRAND violations. "The evidence does not support Apple's allegation that Samsung failed to offer Apple licenses to Samsung's declared-essential patents on FRAND terms," the judge wrote. "Negotiations often involve a process of offer and counteroffer before the parties arrive at an agreed price, but Apple's evidence does not demonstrate that Apple put forth a sincere, bona fide effort to bargain with Samsung."

Under ITC rules, that initial determination has been automatically appealed to larger panel of ITC judges, who are expected to rule in the next four months. Apple and Samsung were both asked to advise the ITC on whether an import ban against Apple would be in the public interest.

In Apple's brief, Wilmer reiterates its earlier arguments, writing that "allowing Samsung to renege on its FRAND commitments through the issuance of an exclusion order would have consequences extending beyond this case, and the harm to be the public interest would be severe." To bolster that claim, Apple states quite matter-of-factly that Samsung's FRAND activities are being investigated by the DOJ and by European regulators.

We knew about the European investigation months ago, but the DOJ investigation is news. The DOJ had never announced an antitrust investigation against Samsung, although an anonymous source tipped Bloomberg in June that "the Justice Department will scrutinize Samsung Electronics Co.'s handling of industry-standard patent claims."

Samsung isn't the only smartphone-maker to come under scrutiny for alleged abuse of standards-essential patents. Google Inc.'s Motorola Mobility unit is facing an Federal Trade Commission investigation. And in June, influential Seventh Circuit judge Richard Posner, sitting by designation in U.S. district court in Chicago, dismissed patent claims Motorola brought an against Apple, ruling that Motorola is "going for broke" by demanding a 2.25 percent royalty on FRAND patents.

Apple is represented by a Wilmer team including William Lee. Samsung is represented by lawyers at Quinn Emanuel Urquhart & Sullivan led by Charles Verhoeven.

Toshiba Next NAND- 3D with 15 Layers

The winner for the next flash memory approach is still not clear. A strong candidate is stacking memory NAND dies one on top of another. The dies are connected using Through Silicon Vias (TSV). Toshiba has a different approach to 3D " not stacking NAND chips one atop the other but rather stacking layers of NAND in a single chip" See more details below.

The key concern for next NAND generations is the 5 years lead time to build a new $5 billion fab, which could be designed for the wrong process technology.

It does not help that "the number of electrons in a gate decreases as the process geometry size is reduced....below 10nm the number of critical electrons in a gate can be as few as 10 – and that losing 10 electrons could seriously affect the gate's functioning. He says there are a variety of issues with such very small cells, such as bit-line loading, interference and leakage, leading to signal retention and reliability issues, for which, currently, there are no solutions.

These problems may make 10nm NAND technology impractical and sub-10nm impossible. Park suggests that 3D stacking, putting dies on on top of another, could be away out of this trap. He charts various approaches and identifies issues with each one, mentioning yield and retention as overall issues" (see more at Flashboys: HEELLLP, we're trapped in a process size shrink crunch)

Ron
www.maltiel-consulting.com



The 3D die stack tack: Toshiba builds towering column of flash


Resistance is futile
By Chris Mellor, 15th October 2012 09:28 GMT


Toshiba is building high rise flash and ReRAM chips, with prototypes coming next year and volume shipping in 2015.

The idea of high-rise or 3D chips is that we can sidestep limitations on increasing the storage density of flash or memory chips by stacking them one on top of the other, increasing the storage density on a Mbits/in 2 basis by building upwards, in the same way as high-rise housing increases the number of people living in the ground footprint of a block of flats.

Hot on the heels of our story about the NAND scaling trap [1], with 3D NAND and ReRAM suggested as two of the potential escape routes, we learn from Nikkei Electronics [2] that Toshiba is building 3D dies using a type of NAND, its p-BiCS (pipe-shaped Bit Cost Scalable) [3] technology, and also a coming replacement technology for NAND, ReRAM (Resistive RAM) which combines attributes of RAM and NAND to provide byte addressability, DRAM-class speed and NAND non-volatility.

As the slide below shows, 3D flash involves layers of NAND dies with communicating holes - TSVs or Through Silicon Vias - linking them to a stack controller at the base of the stack. It is not stacking NAND chips one atop the other but rather stacking layers of NAND in a single chip.

Toshiba p-BiCS technology [4]

Toshiba's p-BiCS NAND has a 50nm-size hole and 16 layers. Toshiba's chief engineer, Masaki Momodomi, at its Semiconductor & Storage Products Co., says that p-BiCS becomes cheaper than ordinary NAND when more than 15 layers are used, presumably comparing similar capacity levels. The company aims to deliver 128Gbit and 256Gbit prototype samples next year, engineering samples in 2014, with volume shipments in 2015; we are more than two years away from seeing product hit the streets.

The ReRAM [5] technology has a similar timescale though at lower capacities. It has much faster write times than NAND and Toshiba sees it fulfilling a different role from p-BiCS, being used closer to CPUs than p-BiCS, with STT-RAM being used for cache memories in, for example, SSDs. This is a similar hierarchy to the one proposed by Hynix in our NAND Scaling Trap story today. Jim Handy of Objective Analysis said; "It makes sense that ReRAM … would be used in performance applications, though. They are far faster at writes than NAND is, they are random access devices which NAND is not, and they don't need ECC. All this lends itself to faster performance."

Toshiba's ReRAM technology will appear in the same sequence of prototype samples, engineering samples and volume production as p-BiCS with the same general timing. A picture of a 64Gbit ReRAM device was shown at the Toshiba briefing attended by Nikkei Electronic but Toshiba intends to deliver generally equivalent p-BiCS and ReRAM capacities.

It is set of reducing the size of its current 1Xnm (19nm) NAND cells, and will target 1Ynm (18-14nm we understand) products this year and 1Znm (10-13nm) products next year.

Handy said: "All those new technologies (MRAM, ReRAM, FRAM...) perform better than NAND (BiCS is a kind of NAND) but are more costly. In memory cost is everything so these alternatives don't do well. The promise of these technologies is that they will move right past NAND's scaling limit. If they do that they will eventually become cheaper than NAND, but not until NAND has stopped scaling for 2 process generations.

"Toshiba talks about 1y and 1z, their processes after 19nm. I suspect that NAND will stop scaling at around 10nm, but BiCS will cause NAND pricing to continue to decline after that. Of course, those geniuses who have been coaxing NAND as far as 19nm could very well keep pulling rabbits out of their hats and push it well beyond 10nm - time will tell."

Will we see continued NAND process size decreases or 3D as the chosen way to get more capacity from a NAND die's footprint? Handy said: "The most recent ITRS [International Technology Roadmap for Semiconductors] [6] roadmap plots out two different directions for NAND - vertical (BiCS) and conventional. The industry really doesn't know where it's going to go, but it has plans in place for either eventuality."

Next iPhone A7 Made by TSMC not Samsung

Considering Samsung's market share in smart phones and the legal patent fights with Apple, it would make sense that Apple would want to reduce their reliance on Samsung.

The article in Korea Times (see below) discusses the change.  It take years to shift from one foundry vendor to another. Designing the A6x or A7 new processor and the details and design rules of the manufacturing process is  slow and complicated.

I already discussed Apple Cutting Out Samsung Chips?
("Teardown of iPhone 5 reveals that none of the DRAM, and NAND memory and other chips on the iPhone were not made by Samsung. Already in the iPad (See March iPad teardown) Samsung had fewer parts than in the prior Apple products. Samsung is still making the A6 processor for Apple.")


Ron

http://www.maltiel-consulting.com/



Apple gets serious about Reducing reliance on Samsung smartphone chips


By Kim Yoo-chul By Kim Yoo-chul


Samsung Electronics and Apple have been technology's oddest bedfellows: bitter foes in finished products but indispensible as friends in parts like chips and screens. Samsung Electronics and Apple have been technology's oddest bedfellows: bitter foes in finished products but indispensible as friends in parts like chips and screens.

But with Apple moving quickly to reduce its reliance on Samsung's semiconductor capability amid an intensifying intellectual property dispute between the companies in smartphones and tablets, the relationship is now about to become one-dimensional. But with Apple moving quickly to reduce its reliance on Samsung's semiconductor capability amid an intensifying intellectual property disputes between the companies in smartphones and tablets, the relationship is now about to become one-dimensional.

According to industry sources, Apple has not collaborated with Samsung in the process to develop its A6 microprocessor used in its latest iPhone 5. According to industry sources, Apple has not collaborated with Samsung in the process to develop its A6 microprocessor used in its latest iPhone 5. Samsung has handled the manufacturing of the processors used in previous iPhones and believed to have contributed in their design to some degree. Samsung has handled the manufacturing of the processors used in previous iPhones and believed to have Contributed to Their design to some degree.

Apple is still relying on the Korean firm to manufacture its chips but has made it clear it will no longer use its rival's technology, according to a senior Samsung official. Apple is still relying on the Korean firm to manufacture its chips but has made it clear it will no longer use its rival's technology, According to a senior Samsung official.

``Samsung's agreement with Apple is limited to manufacturing the A6 processors. `` Samsung's agreement with Apple is limited to the manufacturing A6 processors. Apple did all the design and we are just producing the chips on a foundry basis,'' he said on the sidelines of a technology fair at KINTEX in Goyang, Gyeonggi Province. Apple did all the design and we are just producing the chips on a foundry basis,'' he said on the sidelines of a technology fair at KINTEX in Goyang, Gyeonggi Province.

This confirms that the wedge between the technology giants has been driven deeper than it looked from the outside. This Confirms That the wedge between the technology giants has been driven deeper than it looked from the outside. Both companies have been bringing lawsuits against each other around the globe since the American firm accused its Korean competitor of copying the look and feel of its iPhones and iPads early last year when launching its own smartphones and touch-screen tablets. Both companies have been Bringing lawsuits against each other around the globe since the American firm accused its Korean competitor of copying the look and feel of its iPhones and iPads early last year When launching its own smartphones and touch-screen tablets.

Park Hyun, a senior analyst at Tongyang Securities, believes Samsung's souring relationship with Apple could have a significant business effect. Park Hyun, a senior analyst at Tongyang Securities, Samsung Believes's souring relationship with Apple could have a significant business effect.

``It appears that Samsung is losing its multibillion dollar partnership as Apple has been its biggest parts client,'' Park said. `` It appears that Samsung is losing its multibillion dollar partnership as Apple has been its biggest client parts,'' Park said.

Since the early 2000s, Samsung has been involved in designing of Apple's A-range of chips as the main manufacturer. Since the early 2000s, Samsung has been Involved in designing of Apple's A-range of chips as the main manufacturer. Samsung technologies contributed in the development of the A6 predecessors A5 and A5X, thanks to a broad agreement between the two companies. Samsung Contributed technologies in the development of the A5 and A6 Predecessors A5X, thanks to a broad agreement between the two companies. It now appears that the structure of the deal has been dramatically adjusted. It now appears that the structure of the deal has been dramatically adjusted.

``There are three kinds of chip clients. `` There are three kinds of chip clients. Some want us to handle everything from chip design, architecture and manufacturing. Some want us to handle everything from chip design, architecture and manufacturing. Some want us to just design and manufacture. Some just want us to design and manufacture. Some want us to just make the chips. Some just want us to make the chips. Apple is now the third type,'' said the Samsung source. Apple is now the third type,'' said the Samsung source.

A hint of the rift between the firms over chips came last week when one of Samsung's top semiconductor designers, Jim Mergard, moved to Apple. A hint of the rift between the firms over chips came last week When one of Samsung's top semiconductor designers, Jim Mergard, moved to Apple. Mergard is known for his skills and experience in advanced application processors and low-power chips for mobile devices. Mergard is known for his skills and experience in advanced application processors and low-power chips for mobile devices.

``The high-profile hiring of someone like Mergard directly from a big rival no doubt increases mutual tension. `` The high-profile hiring of someone like Mergard Directly from a big rival no doubt Increases mutual tension. Apple wants to internalize its management, even for application processors, and to lower its dependency on Samsung for those logic chips,'' said the source. Apple wants to internalize its management, even for application processors, and to lower its dependency on Samsung For Those logic chips,'' said the source.

Samsung did manage to earn a larger paycheck from Apple for manufacturing the A6 than the previous processors. Samsung did manage to earn a larger paycheck from Apple for manufacturing the A6 than the previous processors. After all, it is probably the only semiconductor in the world that can do the heavy work for Apple in terms of making a large volume of high quality chips over a short period of time. After all, it is probably the only semiconductor in the world That can do the heavy work for Apple in terms of making a large volume of high quality chips over a short period of time.

Apple's last big investment in chips was in early 2010 with the acquisition of Texas-based Intrinsity. Apple's last big investment in chips was in early 2010 with the acquisition of Texas-based Intrinsity. Before that it was the 2008 purchase of chip design firm PA Semi. That it was before the 2008 purchase of chip design firm PA Semi.

Apple recently signed a deal with Taiwan Semiconductor Manufacturing (TSMC) for the production of quad-core processors for future devices and it remains to be seen whether the Taiwanese chipmaker will eventually fill Samsung's shoes. Apple recently signed a deal with Taiwan Semiconductor Manufacturing (TSMC) for the production of quad-core processors for future devices and it remains to be seen Whether the Taiwanese chipmaker will eventually fill Samsung's shoes.

A report from Barclays claimed TSMC will start producing Apple's A7 processors from the first quarter of 2014 and stressed hundreds of TSMC researchers and chip developers are currently set to produce processors that are free from Samsung patents. A report from Barclays Claimed TSMC will start producing Apple's A7 processors from the first quarter of 2014 and stressed Hundreds of TSMC chip Researchers and developers are currently in September to produce processors That Are free from Samsung patents.

``Samsung has already acknowledged that Apple has an appetite to carry out its own central processing unit (CPU) design,'' said another Samsung official familiar with the matter. `` That Samsung has acknowledged Already Apple has an appetite to carry out its own central processing unit (CPU) design,'' said another official familiar with the matter Samsung.

``Apple is threatened by Samsung's rapid rise. `` Threatened by Apple is Samsung's rapid rise. Apple is excluding it from major projects. Apple is EXCLUDING it from major projects. However, it can't completely wipe Samsung from its business partner list,'' he said, adding the US firm is asking Samsung to provide more flash-type memory chips. However, it can not completely wipe Samsung from its business partner list,'' he said, adding the U.S. firm is asking Samsung to Provide more December-type flash memory chips.

As the patent war deepens, the two companies have seen a faster deterioration of their business partnership. As the patent war deepens, the two companies have seen a faster deterioration of their business partnership. Apple has already reduced its memory chip orders from Samsung for the iPhone 5 as it intends to widen its supply chain. Already Apple has reduced its memory chip orders from Samsung for the iPhone 5 as it intends to widen its supply chain.

Unlike memory chips, which just read and write data, application processors control an entire computing system, therefore processor chips are more profitable. Unlike memory chips, Which just read and write data, application processors control an entire computing system, Therefore processor chips are more December profitable.

Samsung has been providing logic chips to Qualcomm, Nvidia and Texas Instruments. Samsung has been providing logic chips to Qualcomm, Nvidia and Texas Instruments. While the wafer allocation to those companies is increasing, Samsung is being asked to increase its foundry volumes and to build additional logic chip lines to better prepare for Apple's departure. While the wafer is Increasing allocation to Those companies, Samsung is being asked to INCREASE its foundry volumes and to build additional logic chip lines to better prepare for Apple's departure.

``Although Apple has excluded Samsung from key projects, we're not too worried as Samsung is selling more custom chips to other major companies such as Qualcomm and Nvidia,'' said the official. `` Although Apple has Samsung excluded from key projects, we're not too worried as Samsung is selling more December custom chips to other major companies Such as Qualcomm and Nvidia,'' said the official.

Samsung spokesman Ken Noh and Apple spokesman Steve Park refused to provide any comments for this story. Samsung spokesman Ken Noh and Apple spokesman Steve Park refused to Provide any comments for this story.

Japan Fading in Semiconductor Fabrication?

The article below discusses the fab materials market in Japan and states that Japan is maintaining its global position. I don't believe that Japan will be able to maintain its share.

The cause is the rising cost of new process technology. One of the casualties of the $10 Billion cost of developing new semiconductor technologies is Japan's semiconductor industry as is detailed in the March 2012 comment Are Japan's Fabs stuck above 28nm Process Technology?







Ron
http://www.maltiel-consulting.com/




Japan's semiconductor industry: Fabs, equipment, and materials


by Dan Tracy, senior director, SEMI Industry Research and Statistics

October 3, 2012 - Semiconductor manufacturers in Japan are either consolidating or closing fabs, and, in several cases, transitioning to a "fab-lite" strategy, all in a restructuring effort to meet the market challenges ahead. While device manufacturers are consolidating manufacturing operations and plan to outsource more wafer fabrication and package assembly to foundries and packaging subcontractors, a large installed fab capacity remains in Japan. Recent data for the year shows overall wafer area shipments into Japan's fabs being the same as shipments into Taiwan.

By 2014, the total installed fab capacity Japan should increase slightly from about 4.5 million to 4.6 million 200mm equivalent wafers per month. Installed 300mm fab capacity is expected to increase from about 760,000 to 840,000 300mm wafers per month -- representing, by region, the third largest 300mm fab manufacturing capacity base globally. Over the next several years, fab spending in the Japan market will be directed towards the production of NAND flash memory, power semiconductors, high-brightness LEDs, and CMOS image sensors.

Regional share forecasted for 2013 fab materials market. Total market size: $25.7 billion.

Overall equipment spending in Japan will likely range on the order of $4 billion per year. Expected NAND flash investments in 2013 could approach up to $2.5 billion. LED fab equipment spending is estimated to be $340 million next year. Finally, Sony is expected to invest about US$ 1 billion or more in its CMOS image sensor production.

Japanese equipment and material suppliers are leading players on the global semiconductor industry stage. It is estimated that Japan-headquartered equipment companies collectively capture about 35% share of the global semiconductor industry spending per annum. Like their North American and European counterparts, customers in the rest of the Asia Pacific region are the largest base for new equipment sales.

Chemical and other material suppliers in Japan are market leaders in the manufacturing of silicon wafers, III-V wafers, advanced chemicals, packaging resins, and packaging substrates. It is estimated that the Japanese material suppliers sales represent about 70% of the global semiconductor materials market, both fab and packaging.

Japanese suppliers showcase the latest products at SEMICON Japan 2012

Leading Japanese equipment and materials suppliers will exhibit at SEMICON Japan 2012 on December 5- 7, along with global key players, at the Makuhari Messe, Japan. Find the latest products and innovations this companies offer to customers globally that enable key technologies for the future including 450mm, EUV, TSV, power devices, and HB-LEDs to name a few. Also, the show will co-locate with a major photovoltaic show, PVJapan 2012 so you can connect to two major microelectronics industries in a single visit.

Android vs iPad Sales 48% to 52%

Similar to the history of  android phones vs. iPhone sales growth, Android tablets sales are approaching iPad sales. Android tablet sales are likely to surpass iPad sales this year.

A key reason for android tablet's strength is the multitude of products made by many vendors using the Android platform. The introduction of a new kindle fire by Amazon and other vendors updating their offering will propel this trend.

It is very tough for a single company to control the market with just one dedicated product line.

The article below discusses that the Android tablet is growing faster than iPad " In the year of 2012, Android holds a whopping 48% of all U.S. tablet sales, bringing Apple’s iPad into reach at just 52%"


Ron
http://www.maltiel-consulting.com/



Pew Research: Android Up to 48% of U.S. Tablet Sales, iPad Drops to Low of 52%
by: Tim-o-tato 10.02.12

A new study from the Pew Research Center has pegged Android at a spot in the tablet market that we didn’t think would come this early in the game. In the year of 2012, Android holds a whopping 48% of all U.S. tablet sales, bringing Apple’s iPad into reach at just 52%. Although, Amazon’s Kindle Fire accounts for a hefty 21% of Android’s tablet market success. And do keep in mind, these numbers do not reflect Nexus 7 or Kindle Fire HD sales yet.

The study also shows the world sales data, which differs quite a bit. According to the report, Apple still holds a commanding 61% of the world’s tablet market with Android coming in at a much lower 31%. But hey, things are looking up for Google’s Android. Once numbers are published reflecting the seemingly popular Nexus 7 and Kindle Fire HD tabs, these numbers are sure to change a wee bit.




14 Reasons for the Google Nexus 7 vs Nine Reasons for the Apple iPad 3 64GB
A detailed table is in the article.

An opposing view is at-
An iPad Lover’s Take On The Nexus 7
Mg Siegler Sunday, July 15th, 2012144

MG Siegler is a general partner at CrunchFund and a columnist for TechCrunch, where he has been writing since 2009. His focus is on Apple. Prior to TechCrunch, MG covered various technology beats for VentureBeat. Originally from Ohio, MG attended the University of Michigan in Ann Arbor, MI. He’s previously lived in Los Angeles where he worked in Hollywood and in... → Learn More

Trolls, feel free to skip to the bottom of this column and post your comments immediately without reading a word. Actually, who are we kidding — you didn’t make it this far.

Everyone else, brace yourselves. You may want small children to leave the room. I’m about to do something I don’t do often — something I always said I’d do if the product deserved

Semiconductor Foundries:Strong Q2, but Slowdown..

The article below discusses foundries' strong Q2  results, while predicting a slower Q3.

"Pure-play foundry semiconductor manufacturers enjoyed a robust second quarter thanks to enthusiastic consumer purchasing of wireless products like mobile handsets and tablets, but the industry is slowing down in the second half of 2012 as economic tremors roil the supply chain"

However, I wonder about the impact of the slow ramp-up of manufacturing wafers using the 28nm manufacturing process in Q2 and Q3. There is pent up demand for wafers built using the 28nm process which could impact Q4 (see April 2012 comments Qualcomm and Nvidia 28 nm Wafers? Shortage... and March 2012 comments Nvidia: TSMC 20nm Essentially Worthless). The lack of 28nm wafers negatively impacted Qulacomm, Nvidia and other companies.

Another potential upside for the second half of 2012 is the introduction of window 8 and its impact on demand for tablet computers.

Ron
http://www.maltiel-consulting.com/





Semiconductor Foundries Enjoyed Strong Q2, but Slowdown Looms


Global economic uncertainties and a wary buying public will dampen prospects until mid-next year

Len Jelinek October 2, 2012
Pure-play foundry semiconductor manufacturers enjoyed a robust second quarter thanks to enthusiastic consumer purchasing of wireless products like mobile handsets and tablets, but the industry is slowing down in the second half of 2012 as economic tremors roil the supply chain, according to an IHS iSuppli Semiconductor Manufacturing & Supply market tracker report from information and analytics provider IHS.

Revenue for pure-play foundry suppliers—companies whose entire business involves producing semiconductors for other firms—reached $7.8 billion in the second quarter, up 16 percent from $6.7 billion in the first quarter.

The second-quarter expansion will prove to be the strongest this year, as forecasts show a slowdown occurring during the next two quarters. Revenue of $8.3 billion is projected for the third quarter, equivalent to a weaker sequential growth of 8 percent. A seasonal decline of 5 percent in the fourth quarter then will follow, dropping revenue for the period to $7.9 billion.

The strong showing of the second quarter this year is atypical. Even though the third quarter is the largest revenue period for the foundry sector, a new pattern of manufacturing has emerged, with initial product shipments from foundry suppliers for new design wins now moving from the third quarter to the second. This shift is related to end suppliers introducing next-generation wireless products, like cellphones and tablets, earlier in the year in order to capitalize on sales during a longer period—one lasting three quarters, instead of the usual two quarter time frame that traditionally starts at the beginning of the second half.

As a result of the shift, foundry suppliers must start to adjust technology development and factory expansion plans to mirror these changes. Shipments in the third quarter are now also a direct reflection of second-quarter performance.


Impending Q3 concerns on the horizon

The third quarter this year, however, is when manufacturers can begin to anticipate a reduction in orders, IHS iSuppli predicts. While demand for advanced technology will continue to drive overall revenue growth within the industry, the effects of external influences—such as a deteriorating global economy—will start being felt. The financial issues in Europe, for instance, will leave their mark in Asia as well as North America, and shaky consumer confidence throughout the world will result in an uncertain outlook for holiday spending. The end result would be a greater amount of inventory left throughout the industry.

Questions also abound on whether consumers will be willing during the next few months to pay for the latest technology rollouts. Unlike last year when holiday shoppers were enticed to purchase lower-cost electronics resulting from excess inventory, this year will be different, with consumers seeing a complete set of new electronics offerings focused on mobile communications, including next-generation tablets, feature-rich smartphones and Ultrabooks with the soon-to-be-launched Windows 8 operating system.

And while the potential exists for increased sales in the second half, any projected upticks are likely to be insufficient to drive major revenue increases for foundry players. This is because any innovative products introduced at this time will be too late to have any tangible effect on revenue for the remainder of the year.

At the current production pace, foundry manufacturing run rates will be negatively affected through the first quarter next year lasting until the first half of the second quarter, IHS iSuppli believes. The industry will begin to recover after that, with the third quarter next year anticipated to grow by a sequential 10 percent.

Lenovo Prove: Outsourcing is Not the Only Way (Updated)

The article below discusses Lenovo, the world's No. 2 personal-computer maker's entry into PC manufacturing in North Carolina next year.

Lenovo is not outsourcing its manufacturing as is done by other vendors (see July article Lenovo Prove: Outsourcing is Not the Only Way)




The July article discusses how Lenovo has been successful manufacturing in house. It is a good way to avoid the commodity PC price squeeze.

Lenovo Chief Technology Officer says the strategy is playing a key role in the development of new products. "If you look at the industry trends, most innovations for" PCs, smartphones, tablets and smart TVs are "related to innovation of key components—display, battery and storage," he said. "Differentiation of key parts is so important. So we started investing more…and working very closely with key parts suppliers" for things like bigger and thinner touch screens."


Ron

http://www.maltiel-consulting.com/









Lenovo to Set Up PC Plant in U.S.
By JURO OSAWA   October 2, 2012, 12:57 a.m. ET

Chinese computer-maker Lenovo Group Ltd. will start manufacturing PCs in North Carolina next year. Company executives said the effort, starting with only a few million dollars and just over 100 workers, will be the beginning of something bigger, rather than a one-time made-in-America publicity effort.

The world's No. 2 personal-computer maker says the PC production line now being built at a facility in Whitsett, N.C., will allow the company to become more responsive to U.S. corporate clients' demand for flexible supplies and product customization. Although the cost of U.S. production will be higher compared with overseas production, an added benefit will be to raise Lenovo's profile in the U.S., where it ranks fourth in market share by shipment.

"Us having a [production] facility here in a home country is a differentiator that people will value," said Lenovo North America President David Schmoock. He said the incentive for the move is similar to companies taking steps to become more environmentally sustainable. "Being green is not necessarily the lowest-cost option for a lot of companies, but you do it because your customers and partners value you being green."

While the investment is tiny for Lenovo, whose revenue was nearly $30 billion in the most recent fiscal year, it is a symbolic move for the company that rose to international prominence when it bought the PC business of International Business Machines Corp. in 2005. And with its new production line in North Carolina, Lenovo will stand apart from its U.S. rivals—No. 1 PC maker Hewlett-Packard Co., HPQ -3.09%Dell Inc. DELL +0.58%and Apple Inc. AAPL +0.32%—which no longer make personal computers in the U.S.

Lenovo executives said the new production line isn't a temporary publicity stunt. "I believe this is the first of many steps to increase our production capability," Mr. Schmoock said. "I'm very, very bullish about what I can get out of this facility."

Gerry Smith, Lenovo's head of global supply chain, said the decision to set up a production site in the U.S. is in line with the company's broader strategy of localizing its production in major markets as much as possible.

"Now we are big enough in the U.S. to justify this move," he said.

The move also comes as political rhetoric against Chinese companies heats up in the U.S. Last week, President Barack Obama prevented a company owned by two Chinese nationals from acquiring four wind-farm projects in Oregon, saying that those sites are all within or near restricted airspace. Mitt Romney, Mr. Obama's Republican rival in November's presidential election, also has taken a harsh tone against China.

Critics of China have focused on national security, industrial spying and job losses. Chinese telecommunications suppliers Huawei Technologies Co. and ZTE Corp. 000063.SZ +5.48%are being investigated by the U.S. House of Representatives Intelligence Committee over whether their gear could be used to spy on the U.S.

Mr. Schmoock said the decision to introduce a production line in the U.S. isn't a response to the political climate. Lenovo's customers already know that Lenovo is a "truly global" company, he said. "I don't think there's any negative perception we have to overcome."

Lenovo manufactures close to half of the computers it sells, far more than its U.S. rivals. Currently, the PCs that Lenovo sells in the U.S. are produced at the company's Mexican or Chinese factories.

Despite owning the well-regarded ThinkPad brand and having a solid presence in the U.S. market for PCs used in offices and schools, Lenovo has yet to become a major brand for general consumers in the U.S. Its global market share in PCs is about 15% but its U.S. market share is 8%, running fourth behind Hewlett-Packard, Dell and Apple, according to research firm IDC.

The new production line will be located near the company's U.S. headquarters outside of Raleigh, N.C. Unemployment in the area has remained stubbornly high, with the jobless rate in the county at 10% compared with the national rate of 8.1%. The factory isn't far from the site of the last Dell PC factory in the U.S., which closed in 2010.
—Ben Worthen contributed to this article.