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Showing posts with label Semiconductor. Show all posts
Showing posts with label Semiconductor. Show all posts

Tuesday, January 5, 2016

Patent Court Ruling and US Semiconductors Industry

The implication of a ruling by "U.S. Court of Appeals for the Federal Circuit—the federal appellate court responsible for all patent law appeals—made the entire industry gasp with its Carnegie Mellon University v. Marvell decision in August. In its ruling, the court suggested that a chip merely designed in the United States may infringe a U.S. patent, even if the contract is inked overseas and the chip is made, delivered and used in another country, never once touching American soil. If this suggestion becomes law.." is discussed below.

Time will tell how this decision will impact future semiconductor patent litigation cases. On the surface, based on this case any product that was designed in the US is infringed even if all sales are outside of USA. The determining factor will be the meaning of "design win" (see below).


Ron
Insightful, timely, and accurate semiconductor consulting.
Semiconductor information and news at - http://www.maltiel-consulting.com/




The Decision That Could Change the US Semiconductor Industry

Benjamin T. Horton and Cameron B. Pick, Corporate Counsel
December 24, 2015
The United States is the undisputed leader of the semiconductor world. It’s a $340 billion industry that spent $35 billion on research and development in 2014, and has spent at least 15 percent of the industry’s revenue on R&D in each of the last 15 years. Seventeen of the top 25 global semiconductor design companies—and nine of the top 10—are based in the United States, according to the Committee on Comparative National Innovation Policies. There are roughly 250,000 domestic semiconductor jobs, with another 1 million supporting jobs. As the Semiconductor Industry Association says, “It All Starts Here.”
It is understandable, then, that the U.S. Court of Appeals for the Federal Circuit—the federal appellate court responsible for all patent law appeals—made the entire industry gasp with its Carnegie Mellon University v. Marvell decision in August. In its ruling, the court suggested that a chip merely designed in the United States may infringe a U.S. patent, even if the contract is inked overseas and the chip is made, delivered and used in another country, never once touching American soil. If this suggestion becomes law, the impact would be seismic.
Though it offered this suggestion, the court did not actually decide whether Marvell’s international sales infringed Carnegie Mellon’s U.S. patents, so all is not yet lost. Rather, all is open for debate. Title 35 of the United States Code says, “whoever without authority makes, uses … or sells … within the United States … infringes the patent.” 35 U.S.C. § 271(a). The court seemed content that chips cannot infringe U.S. patents if they were internationally manufactured, shipped and used. Whether those same chips are considered “sold” in the United States, however, was not quite so simple a question for the court. The court’s uncertainty comes as a shock. Until now, most of the patent world had been quite certain that chips made, shipped and used outside the United States are very much extraterritorial.
The Court’s Earlier Views
The Federal Circuit was not always so unsure of the boundaries of extraterritoriality when it came to semiconductors. In fact, it used to be relatively straightforward. In Power Integrations v. Fairchild Semiconductor (2013), for example, the Federal Circuit decided that the patent owner could not recover lost profits based on the defendant’s foreign sales of chips made and shipped abroad, even assuming that the foreign sales were “the direct, foreseeable result of Fairchild’s domestic infringement.” There, the court stated, “foreign exploitation of a patented invention ... is not infringement at all.” Similarly, in Halo Electronics v. Pulse Electronics (2014), the Federal Circuit found that the defendant met regularly with Cisco design engineers in the U.S., sent product samples to Cisco for pre-approval in the U.S., attended sales meetings with customers in the U.S. and provided post-sale support for products in the U.S. The court decided that this did not constitute a sale within the U.S., because the products were “manufactured, ordered, invoiced, shipped, and delivered abroad.” In the most recent decision, however, the court seemed to be going in a different direction.
In Carnegie Mellon, the Federal Circuit reiterated some well-known concepts on the location of a sale, e.g. the place of the legal commitment to buy and sell, the place of delivery and the place of ordering. But the court further stated that “[t]he standards for determining where a sale may be said to occur do not pinpoint a single, universally applicable fact that determines the answer, and it is not even settled whether a sale can have more than one location.” The court went on to broadly suggest that a sale may occur at the place where substantial activities of the sales transactions occurred. This “substantial activities” language seems to embody the court’s recent uncertainty on extraterritoriality. As part of that uncertainty, the court suggested that the design of a chip could be part of the chip’s sales cycle and, therefore, may be considered “substantial activity,” especially if the activity is custom design, or a “design win,” something the court considered more closely integrated with the sales cycle. According toQuality-Adjusted Price Measurement: A New Approach With Evidence from Semiconductors, custom design wins may account for as much as 25 percent of the semiconductor industry, making the court’s suggestion an expensive one.
The Meaning of a ‘Design Win’
So what, exactly, does the Federal Circuit consider a design win? According to the court, a design win occurs when a designer’s custom chip is purchased and enters mass production. Generally, a design win results in exclusive use of the customized chip for a certain period. To secure a design win, the design is tailored to the customer’s product. This typically encompasses a lengthy sales cycle involving extensive joint work over several years, which may include designing, simulating, testing, evaluating and qualifying the chips, and likely providing samples. With all these considerations, a design win may involve a bevy of new steps, factors and locations.
So the Federal Circuit is now fascinated with design wins. What does that mean? It means that products and transactions previously thought to be extraterritorial, and therefore beyond the reach of U.S. patents, are vulnerable. The court’s discussion of what activity constitutes a design win, however, may provide clues as to how a semiconductor company might shift (from a legal standpoint) design wins outside the United States, even if some portion of the design is done in the United States. For each design win factor located outside the United States, the sale of the chip may be more likely to be considered extraterritorial, and therefore outside the scope of United States patents.
Possible Solutions
So how can a company with U.S. design activity, particularly custom design activity, move “design wins” overseas? Here are a few suggestions based on the court’s discussion:
• Simulations Perform system simulations and post-layout simulations for custom designs on overseas machines, and provide waveforms from the system simulations to overseas customers, even if unit and subsystem simulations occur in the United States and/or the test software for the simulations is developed in the United States.
• Manufacture/Marking Relocate manufacturing of sample custom products to foreign foundries, and move or outsource the sample marking process overseas.
• Storage Store samples (even temporarily) overseas before they ultimately reach the foreign customer. This way, no product ships directly from the United States.
• Program/Configure Relocate the programming or configuration of sample devices overseas.
• Test Move the testing process, or at least a component of the testing process (e.g. burn-in or ESD), overseas. Even if the protocol or software is developed in the United States, an oven or lab in another country can shift a valuable component of the sales cycle.
Currently, there is no timetable as to when these questions about U.S. design activity and U.S. patents may be conclusively resolved. In the meantime, your authors, and an entire industry, will be watching and waiting.
This article is for informational purposes only and is not legal advice.
Posted by Ron at 10:50 AM No comments:
Labels: chip, Design, design win, Fab, Fabrication, foundry, IC, Patents Court, Patents Court Ruling, Semiconductor, Semiconductors Industry, U.S. Court of Appeals for the Federal Circuit

Friday, November 15, 2013

China and 2013 Semiconductor Sales

Based on IC Insight's recent report of 2013 Semiconductor (see below), growth of cell phone sales in China brought Mediatek to the second place in growth ranking of the top 20 semiconductor suppliers. The list includes foundries (TSMC, GlobalFoundries, and UMC) and five fabless companies. IC foundries are included in the top-20 semiconductor supplier.

 
See Smartphone: MediaTek Overtaking Qulacomm
 

"Mediatek is expected to rank 16, up from 22 in last year's list, with smartphone application processor shipments nearly doubling to 200 million up from 108 million last year. The company "is experiencing extremely strong demand for its devices in the booming low-end smartphone business in China and other Asia-Pacific locations."

Micron and Hynix growth benefited from the consolidation of the semiconductor fabs. They were also able to increase their growth for the cell phone market outside of the developed world.

Ron
Insightful, timely, and accurate semiconductor consulting.
Semiconductor information and news at -
http://www.maltiel-consulting.com/







IC Insights Expects Big Changes to 2013 Top 20 Semi Supplier Ranking


SK Hynix, MediaTek, Micron, and Qualcomm each forecast to show ≥30% year-over-year growth.

 Later this month, IC Insights’ November Update to the 2013 McClean Report will show a preliminary ranking of the top 25 semiconductor suppliers in 2013.  A preview of the top 20 companies is listed in Figure 1.  The top 20 worldwide semiconductor (IC and O-S-D—optoelectronic, discrete, and sensor) sales leaders forecast for 2013 include nine suppliers headquartered in the U.S., three in Japan, three in Europe, three in Taiwan, and two in South Korea.

 The top-20 ranking includes three pure-play foundries (TSMC, GlobalFoundries, and UMC) and five fabless companies. IC foundries are included in the top-20 semiconductor supplier ranking because IC Insights has always viewed the ranking as a top supplier list, not as a marketshare ranking, and realizes that in some cases semiconductor sales are double counted.  With many of our clients being vendors to the semiconductor industry (supplying equipment, chemicals, gases, etc.), excluding large IC manufacturers like the foundries would leave significant “holes” in the list of top semiconductor suppliers.  Overall, the list shown in Figure 1 provides a guideline to identify which companies are the leading semiconductor suppliers, whether they are IDMs, fabless companies, or foundries. Excluding the foundries of TSMC, GlobalFoundries, and UMC, from the top-20 ranking would bring Fujitsu ($3,524 million), Marvell ($3,205 million), and Sharp ($3,078 million) into the 18th, 19th, and 20th positions, respectively.

 There are numerous changes expected within the top-20 semiconductor ranking in 2013 as compared to the top 20 ranking of 2012.  Some of the companies forecast to rise in the ranking include SK Hynix, which, despite a significant fire and production set-back at its largest memory fab in China, is taking full advantage of the surge in the DRAM market this year and is expected to move up three places and into the top 5.  Also, Broadcom is forecast to edge into the top 10, Micron is expected to move up two spots, spurred by its acquisition of Elpida in 3Q13, and MediaTek is forecast to jump up six positions to 16th place and into the top-20 ranking for the first time.  MediaTek is experiencing extremely strong demand for its devices in the booming low-end smartphone business in China and other Asia-Pacific locations.  In fact, MediaTek expects its application processor shipments for smartphones to reach over 200 million units this year, about double the 108 million units the company shipped in 2012.

 In contrast to the companies moving up in the ranking, Fujitsu is expected to drop five places to fall out of the top-20 ranking in 2013, going from being ranked 16th in 2012 to 21st this year (the company sold its analog and MCU business to Spansion in August of this year).  Renesas is another “casualty” expected in the top-20 ranking and is forecast to fall to 11th place in 2013 from the 7th position it held in 2012.

 
Figure 1

In total, the top 20 semiconductor companies’ sales are forecast to increase by 7% in 2013 as compared to 2012, which would be two points better than the 5% forecast for the total worldwide semiconductor market this year.  It is expected to take total semiconductor sales of over $3.7 billion to make the top-20 ranking in 2013.

As shown in Figure 2, there is expected to be a 60-percentage-point range of growth rates among the worldwide top 20 semiconductor suppliers in 2013 (from +44% for SK Hynix to -16% for Sony).  The continued success of the fabless/foundry business model and the strong growth of the memory market (especially the 29% DRAM market surge) this year is evident when examining the nine top-20 semiconductor suppliers that are forecast to log higher growth than the total worldwide semiconductor market (5%).  As shown, the top nine performers in 2013 are forecast to include three memory companies (SK Hynix, Micron, and Toshiba), two fabless companies (MediaTek and Qualcomm), and two pure-play foundries (TSMC and GlobalFoundries).

 
Figure 2 
Figure 2 illustrates that the two top-20 ranked companies that are forecast to register double-digit sales declines in 2013 are headquartered in Japan (Renesas and Sony).  As previously mentioned, Japan-based Fujitsu is also expected to register a double-digit decline (-15%) in 2013 and drop out of the top 20 ranking this year.  However, it should be noted that the conversion of Japanese company semiconductor sales from yen to U.S. dollars, at 96.96 yen per dollar forecast for 2013 versus the 79.70 yen per dollar rate in 2012, is expected to have a significant impact on the sales figures for the Japanese companies.  Using a constant 2012 U.S. dollar versus Japanese yen exchange rate for 2013, the forecasted 2013 semiconductor sales increases of Sony, Fujitsu, and Renesas would be 4%, 3%, and 2%, respectively.
Posted by Ron at 6:47 AM No comments:
Labels: China, fabless, fabrication expert, foundries, GlobalFoundries, growth ranking, IC foundries, MediaTek, process expert, Semiconductor, suppliers, TSMC, UMC

Friday, September 20, 2013

iPhone 5s Teardown


Teardown of iPhone 5s by iFixit is below. Key IC in the latest Apple smart phone are:
  • Murata 339S0205 Wi-Fi module (based on the Broadcom BCM4334, according to Chipworks)
  • SK Hynix H2JTDG8UD3MBR 128 Gb (16 GB) NAND Flash
  • Qualcomm PM8018 RF power management IC
  • TriQuint TQM6M6224
  • Apple 338S1216
  • Broadcom BCM5976 touchscreen controller
  • Texas Instruments 37C64G1
  • Skyworks 77810
  • Skyworks 77355
  • Avago A790720, A7900
  • Apple 338S120L
  • Apple A7 APL0698 SoC (based on this MacRumors post, the markings F8164A1PD indicate the RAM is likely 1GB), was fabbed in July.
  • Qualcomm MDM9615M LTE Modem,  WTR1605L LTE/HSPA+/CDMA2K/TDSCDMA/EDGE/GPS transceiver.

  • Along with the fingerprint sensor, the A7 is a major enticement for consumers to pick the 5s over the 5c.
  • The A7 is advertised as providing twice the performance of the 5 (and 5c)'s A6 processor.
    • The switch to the A7 marks the first use of a 64-bit processor in a smartphone. Based on AnandTech's review, it seems that the bulk of the A7's performance gains do not come from any advantages inherent to a 64-bit architecture, but rather from the switch from the outdated ARMv7 instruction set to the newly-designed ARMv8.
    • The modern ARMv8 instruction set was designed for a 64-bit architecture. It does away with the legacy support of the last 20 years, which increases efficiency, improving performance without sacrificing battery life.
  •  

 iPhone 5s Teardown


    Teardown

    Teardown

    Teardowns provide a look inside a device and should not be used as disassembly instructions.
    Featured Guide

    Featured Guide

    This guide has been found to be exceptionally cool by the iFixit staff.
    One…Three…G…Three…G again…S!…Four…Four again!…And another S!… Five!…S!...Five?!…C!
    Thankfully Apple is in the technology business, not the education business. We can only imagine how jumbled pre-school students' ABCs and 123s would be if they were taught in Cupertino.
    Crazy nomenclature aside, we were anxious to bite into this latest piece of phone fruit. So anxious, in fact, that we sent one of our own to the land down-under to get one.
    Join us as we dissect the latest iPhone; otherwise:
    Instagram for kooky pictures, Twitter for quirky quips, Facebook if you wanna be friends.
    Read More

    Add NoteEditStep 1 — iPhone 5s Teardown 

    • An iPhone release means a trip to the future—the iFixit teardown crew has traveled 17 hours forward in time to get the iPhone 5s early.
    • We want to send out a big thanks to our good friends at MacFixit Australia for letting us use their office in Melbourne for the teardown. They stock Mac and iPhone upgrades/accessories, and also carry ouriFixit toolkits.
      • To cover all our bases, we confirmed with our best linguists that the 5s upside-down is still the 5s.
    • Speaking of toolkits, for this teardown, we'll be using iFixit's brand-new Pro Tech Screwdriver Set.

    1 Add NoteEditStep 2 

    • As we ready ourselves to delve into the delightful innards of the 5s, let's check out some of its tech specs:
      • Apple A7 processor with 64-bit architecture
      • M7 motion co-processor
      • 16, 32, or 64 GB Storage
      • 4-inch retina display with 326 ppi
      • 8 MP iSight camera (with larger 1.5µ pixels) and a 1.2MP FaceTime camera.
      • Fingerprint identity sensor built into the home button
      • .........

      Image #1Image #2

      1 Add NoteEditStep 12 

      • Looks like we found a Murata 339S0205 Wi-Fi module (based on the Broadcom BCM4334, according to Chipworks).
      • Again comparing our 16 and 64 GB models:
        • It seems that the Murata IC is the same between both iPhone 5s'.
        • The design of both logic boards may be identical, but slight differences in markings (e.g. 94V-0 on the rightmost, nonexistent on the leftmost) may indicate that Apple is manufacturing the 5s logic boards at multiple locations.
      Image #1

      1 Add NoteEditStep 13 

      • Open ses-EMI! Behold, IC treasures identified:
        • SK Hynix H2JTDG8UD3MBR 128 Gb (16 GB) NAND Flash
        • Qualcomm PM8018 RF power management IC
        • TriQuint TQM6M6224
        • Apple 338S1216
        • Broadcom BCM5976 touchscreen controller
        • Texas Instruments 37C64G1
        • Skyworks 77810
      Image #2Image #1

      5 Add NoteEditStep 14 

      • More ICs!
        • Skyworks 77355
        • Avago A790720
        • Avago A7900
        • Apple 338S120L
      • A super-awesome thanks to the Chipworks team for helping us decode and discern these delightful devices!
      Image #1

      3 Add NoteEditStep 15 

      • Turning our attention to the backside of the logic board:
        • Apple A7 APL0698 SoC (based on thisMacRumors post, the markings F8164A1PD indicate the RAM is likely 1GB)
        • Qualcomm MDM9615M LTE Modem
        • Qualcomm WTR1605LLTE/HSPA+/CDMA2K/TDSCDMA/EDGE/GPS transceiver.
      • As we search for a much-anticipated M7 coprocessor, we begin to wonder if it actually is a separate IC, or if it is additional functionality built into the A7.
        • Maybe the "M" stands for "magical," the M7 is invisible, and Apple does use pixie dust to hold the device together. Or perhaps the "M" stands for "marketing"…
      • Our A7 was fabbed in July.
      Image #1Image #2

      3 Add NoteEditStep 16 

      • It's time to investigate the new kid on the block, and it's fly like an A7. Along with the fingerprint sensor, the A7 is a major enticement for consumers to pick the 5s over the 5c.
      • The A7 is advertised as providing twice the performance of the 5 (and 5c)'s A6 processor.
        • The switch to the A7 marks the first use of a 64-bit processor in a smartphone. Based on AnandTech's review, it seems that the bulk of the A7's performance gains do not come from any advantages inherent to a 64-bit architecture, but rather from the switch from the outdated ARMv7 instruction set to the newly-designed ARMv8.
        • The modern ARMv8 instruction set was designed for a 64-bit architecture. It does away with the legacy support of the last 20 years, which increases efficiency, improving performance without sacrificing battery life.
      • We'll have to wait until we get inside the chip to find out who manufactured it.



    Posted by Ron at 7:13 AM 1 comment:
    Labels: A6, A7, Apple, Circuit, circuit expert, DDR, DRAM, expert, Fabrication, Flash, iPad, Memory, microprocessor, Process, processor, Qualcomm, Semiconductor, testify, wafer, witness
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