Showing posts with label processor. Show all posts
Showing posts with label processor. Show all posts

Tuesday, September 29, 2015

Surprise, Samsung's A9 Processor is 9% Smaller than TSMC''s in iPhone 6s


Chipworks reversed engineered Samsung's and TSMC's A9
Apple is using both Samsung and TSMC to fabricate the microprocessor for the new iPhone 6 and 6s (see the article below). A second source is typically used to cut down the risk of depending on only one fab for key component.  It is very interesting that the die size of Samsung is 96 mm2 while TSMC die size is 8.85% larger at 104.5 mm2.

Apple improved the approach of using a second source. It implemented two versions at the same time. When you develop new complex products such as A9 with an embedding mobile processor inside A9 , there are risks that the new processor would not work. By using one design at TSMC, and a shrunk version at Samsung, Apple got ahead on the learning curve. It gave Apple a chance to implement improvement while shrinking the die. In addition, the shrunk die at Samsung reduces the cost of the A9 die.

It will be interesting to know if there are some performance differences between Samsung and TSMC versions.




Ron
Insightful, timely, and accurate semiconductor consulting.
Semiconductor information and news at - http://www.maltiel-consulting.com/





Chipworks: Both Samsung and TSMC are making the A9 chip for Apple

And the Samsung version is smaller than the TSMC version.


The only thing that most people will need to know about Apple's A9 is that it's a whole lot faster than last year's A8. But for those of you who are more interested in chip design, Chipworks has unearthed an interesting tidbit: there are two different versions of the A9 chip, one manufactured by Samsung and another by Taiwan Semiconductor (TSMC). Most interestingly, Samsung's version (the APL0898) has a slightly smaller footprint than the TSMC version (APL1022).
There have long been rumors that Apple was dual-sourcing the A8 from Samsung and TSMC, but this is the first visual proof that we've seen of the practice. iPhone and iPad processors up to and including the A7 were all made by Samsung.
Apple buys other parts from multiple sources including NAND flash and RAM, but the SoC is a major component with bigger implications for performance and power. Chipworks promises a more in-depth look at how the two processors are different, but for now, all we know is that they differ in size.
We have no way to confirm whether the chips in our review samples were made by Samsung or TSMC. iFixit's teardowns found the Samsung version of the A9 in the iPhone 6S and TSMC's version in the iPhone 6S Plus, which makes sense—a larger phone has more room to spare for a larger chip—but that doesn't necessarily mean that all of the phones are being put together this way. In our testing, both the iPhone 6S and 6S Plus benchmarked nearly identically, and both behaved well during Geekbench's thermal throttling test.

Tuesday, May 5, 2015

Apple Watch Manufacturing Highlights

The article below summarize key aspects of the new Apple watch. It is important to remember that Apple goal is to extend its ecosystem to a new interface- the watch. It pushing the manufacturing envelope further-


”The encapsulation of the entire printed circuit board assembly into a single monolithic module is especially noteworthy,” Keller said. “Whereas many products might have some form of semi-flexible encapsulant applied to the board for protection, shock and vibration purposes, Apple has effectively created one large IC out of the entire assembly. This encapsulation is done by encasing the board in the same plastic/epoxy material used for conventional ICs. Indeed, many of the devices found inside the assembly are already encapsulated, effectively creating an IC-within-an-IC affair."



Ron
Insightful, timely, and accurate semiconductor consulting.

Semiconductor information and news at - http://www.maltiel-consulting.com/








Apple Watch has lowest cost to price ratio

Posted by IT-Online on May 5, 2015
The much-anticipated new Apple Watch has the lowest hardware costs compared to retail price of any Apple phone IHS Technology has researched, according to a preliminary estimate by IHS and its Teardown Mobile Handsets Intelligence Service.The teardown of the Apple Watch Sport by IHS Technology estimates that the actual hardware costs are only about 24 percent of the manufacturer’s suggested retail price (MSRP). Estimated hardware cost to MSRP ratios for other Apple products reviewed by IHS are in the range of 29% to 38%.

The teardown of the Apple Watch Sport 38 mm by IHS Technology shows a bill of materials of $81.20 with the cost of production rising to $83.70 when the $2.50 manufacturing expense is added. The retail price of the Apple Watch Sport 38 mm is $349.00. The IHS Technology analysis does not include logistics, amortised capital expenses, overhead, SG&A, R&D, software, IP licensing and other variables throughout the supply chain such as the EMS provider.

“It is fairly typical for a first-generation product rollout to have a higher retail price versus hardware cost,” says Kevin Keller, senior principal analyst-materials and cost benchmarking services for IHS Technology. “While retail prices always tend to decrease over time, the ratio for the Apple Watch is lower than what we saw for the iPhone 6 Plus and other new Apple products, and could be of great benefit to Apple’s bottom line if sales match the interest the Apple Watch has generated.”

There are several new features and manufacturing methods used in the Apple Watch Sport, including: a Pulse Oximeter, Force Touch sensor, “Taptic Engine” feedback, encapsulated modular printed circuit board (PCB) assembly and stacked-die integrated circuits (IC). “While these features have been promoted by Apple and none are necessarily revelatory,” Keller says. “It is noteworthy that many features are appearing for the first time – in combination – in one device. It could be a bellwether for other future Apple products.”

The Taptic Engine built into the Apple Watch, and integrated with the loudspeaker, contains a linear actuator which provides haptic feedback and vibrations. “We found that the device consumes a substantial amount of space inside the watch, and we would expect further miniaturization of this function in future iterations of the product,” he adds.

The preliminary results of the teardown do not show any big surprises in the IC content; all of the manufacturers identified so far were expected. The Apple Watch NAND memory is a Toshiba Flash 8GB and DRAM is a Micron SDRAM 512Mb. Broadcom, STMicro, Maxim, Analogue Devices and NXP are used for connectivity and interface. One noteworthy change is a shift from Invensense to STMicro for the accelerometer/gyroscope.
“The display is LG’s plastic OLED display and the touchscreen overlay module is a TPK Slim GG utilising their ‘Force Touch’ technology,” Keller says. “Force Touch was recently incorporated into the latest MacBook and is expected to be found in the next iPhone generation.”

The fabrication of the enclosure continues the Apple “Unibody” tradition of precision machining from a single block of aluminium. Apple is now extending this design philosophy into a highly miniaturized realm, mating the legacy of precision watchmaking with Apple’s specialized manufacturing practices. As with their previous products, Apple has taken fabrication techniques – once typically restricted to low-volume manufacturing and prototyping – and scaled them into a high-volume production environment.

‘”The encapsulation of the entire printed circuit board assembly into a single monolithic module is especially noteworthy,” Keller said. “Whereas many products might have some form of semi-flexible encapsulant applied to the board for protection, shock and vibration purposes, Apple has effectively created one large IC out of the entire assembly. This encapsulation is done by encasing the board in the same plastic/epoxy material used for conventional ICs. Indeed, many of the devices found inside the assembly are already encapsulated, effectively creating an IC-within-an-IC affair.

“To provide electromagnetic shielding, the encapsulated PCB assembly is further treated with a metalized coating deposited over the surface,” Keller adds. “This shielding process is used in place of conventional stamped sheet metal shielding, saving a significant amount of space, as well as cutting down slightly on weight.”

The Apple Watch is equipped with inductive charging technology and is being shipped with a wireless charger, based on Apple’s own proprietary MagSafe charging technology.
“It has been speculated that the Apple Watch could be compatible with the Wireless Power Consortium’s (WPC) Qi wireless charging specification,” says Vicky Yussuff, analyst-power supplies & wireless power for IHS. “AppleInsider recently shared a video which appears to show the Apple Watch MagSafe charger being used to charge the Moto 360 smart watch. This would suggest that Apple’s charger is Qi-compatible.

“Apple has not been announced as a member of the WPC or even a supporter of the consortium, so it is unlikely that they have produced a ‘certified’ Qi product. However, the Qi specification is an open standard meaning it is still possible for Apple to build products which are compatible to the specification. This could be the case with the Apple Watch MagSafe charger,” Yussuff says. “Although it cannot be verified if both the Moto 360 smartwatch and
Magsafe wireless charger used in the video were both un-modified ‘off the shelf’ products, this could potentially be another boost for the wireless charging industry looking to increase interoperability.”

The Apple Watch battery appears to be somewhat simpler to replace than the batteries in many other Apple products. As long as the display can be carefully removed, the battery is attached with a simple snap-on connector.

Thursday, April 16, 2015

Next iPhone Be Fabricated at TSMC

The article below discuss Apple fabricating 30% of A9 at TSCM fab. A9 is the microprocessor running the next iPhone.








More about Apple fabrication at Samsung and TSCM from October 2012 Apple Cutting Out Samsung Chips


Ron
Insightful, timely, and accurate semiconductor consulting.

Semiconductor information and news at - http://www.maltiel-consulting.com/



Apple makes 'last-minute decision' to use TSMC for 30% of 'A9' chip orders for next iPhone

Facing poor yield rates from chipmaker GlobalFoundries, Apple has apparently made an eleventh-hour call as it solidifies its supply chain for the next-generation iPhone, opting to award nearly a third of "A9" chip orders to Taiwan Semiconductor Manufacturing Co.



Well-connected analyst Ming-Chi Kuo of KGI Securities issued a note to investors on Wednesday, a copy of which was obtained by AppleInsider, revealing that Apple has apparently made what he called a "last-minute decision to recruit TSMC." Apple is said to have called an audible after partner GlobalFoundries continued to experience poor yield rates on production of the next-generation CPU.

Specifically, GlobalFoundries' "A9" chip yield rate is said to currently be at about 30 percent yield rate, which is well below what Kuo said is a mass-production "basic requirement" of 50 percent.
Apple is said to have turned to TSMC after partner GlobalFoundries showed exceptionally poor "A9" chip yield rates of around 30%.
"Recruiting TSMC reduces supply uncertainties for Apple," the analyst said.

Another factor in the decision, according to Kuo, are concerns from Apple that Samsung's chipmaking business may not be able to supply enough of its 14-nanometer design. That's because initial sales of the Galaxy S6 and S6 Edge have apparently been greater than expected, and may pull 14-nanometer orders away from Apple.

Finally, Kuo also indicated that TSMC's competing 16-nanometer FinFET Turbo design has exceeded Apple's expectations in both yield rate and performance.

Another industry analyst said much the same in a report last month. Citing a recent trip to Asia, Timothy Arcuri from Cowen and Company said strong yields and attractive pricing led him to believe that TSMC had secured a large portion of Apple's A9 order. 

Apple's 2015 iPhone update is widely expected to sport a next-generation processor based on a smaller and more efficient design. Multiple reports have indicated that Samsung will build the majority of "A9" processors for Apple's next-generation iPhone. 

Samsung had a stranglehold on Apple's mobile processor business, building all units for the iPhone until last year. That's when TSMC began contributing chips for the iPhone 6 and iPhone 6 Plus, using a 20-nanometer process for the A8 processor that powers Apple's flagship handsets.

Friday, September 19, 2014

iPhone 6+ Secret Sauce

Apple’s customers upgrade cycle to iPhone 6 plus will help many semiconductor companies. The key suppliers are in the article below -

"the biggest winders are Avago, SkyWorks and NXP, who have seen component content for the iPhone 6 increase by 30 to 90 percent compared to the iPhone 5S. Qualcomm also gains more carrier aggregation, and the NAND boost to 128GB "

The 64 bit A8 processor is the secret sauce giving the iPhone its battery and operation performance.



Ron
Insightful, timely, and accurate semiconductor consulting.
Semiconductor information and news at - http://www.maltiel-consulting.com/



What's inside the iPhone 6 Plus?

Summary: A teardown of the new iPhone 6 Plus reveals hidden innovations that Apple didn’t tell us about.
iPhone 6 Plus teardown
(Image: iFixit)
Today's the day that the iPhone 6 finally falls into the sweaty paws of the masses. And one of the first iPhone 6 Pluses off the production line has fallen into the hands of the iFixit team and is immortalized in their latest teardown.

Here is a listing of the chips that have so far been identified:
Inside the iPhone 6 Plus are an array of chips from a number of vendors including Qualcomm, Broadcom, NXP, Texas Instruments, and Avago. And taking pride of place in the middle of all that is Apple's own A8 processor, and that's teamed with 1GB of Elpida LPDDR3 RAM.
  • Apple A8 APL1011 SoC + Elpida 1 GB LPDDR3 RAM (as denoted by the markings EDF8164A3PM-GD-F)
  • NXP LPC18B1UK ARM Cortex-M3 Microcontrollers (which is the proper name for the M8 motion coprocessor)
  • Qualcomm MDM9625M LTE Modem
  • Skyworks 77802-23 Low Band LTE PAD
  • Avago A8020 High Band PAD
  • Avago A8010 Ultra High Band PA + FBARs
  • TriQuint TQF6410 3G EDGE power amplifier module
  • InvenSense MP67B 6-axis gyroscope and accelerometer combo
  • Qualcomm QFE1000 Envelope Tracking IC
  • RF Micro Devices RF5159 Antenna Switch Module
  • SkyWorks 77356-8 Mid Band PAD
  • SK Hynix H2JTDG8UD1BMS 128 Gb (16 GB) NAND Flash
  • Murata 339S0228 Wi-Fi Module
  • Apple/Dialog 338S1251-AZ Power Management IC
  • Broadcom BCM5976 Touchscreen Controller
  • NXP 65V10 NFC module (likely contains an NXP PN544 NFC controller inside)
  • Qualcomm WTR1625L RF Transceiver
  • Qualcomm WFR1620 receive-only companion chip
  • Qualcomm PM8019 power management IC
  • Texas Instruments 343S0694 touch transmitter
  • AMS AS3923 boosted NFC tag front end
  • Cirrus Logic 338S1201 audio codec
According to Sterne Agee analysts Vijay Rakesh and Troy Cowdrey the biggest winders are Avago, SkyWorks and NXP, who have seen component content for the iPhone 6 increase by 30 to 90 percent compared to the iPhone 5S. Qualcomm also gains more carrier aggregation, and the NAND boost to 128GB is also good for memory suppliers Micron and Sandisk.
The battery is a monster 43 gram unit and is rated at 3.82 V and 11.1 Wh of energy, for a total of 2915 mAh, which is nearly double the capacity of the battery found inside the iPhone 5S, and slightly bigger than the battery inside the Galaxy S5. The new battery gives the iPhone 6 Plus up to 24 hours on 3G, and 384 hours of standby time, which is a huge increase over both the iPhone 5S and the iPhone 6.
iPhone 6 Plus battery
(Image: iFixit)
There are also many more internal improvements that apple has made to the iPhone 6 Plus. The new iSight camera features phase-detection autofocus – common on DSLRs but relatively new to smartphones – and optical stabilization.
However, when it comes to the protruding "camera nubbin," even iFixit are worried about the impact and impact might have on it (pun fully intended).
"The lens cover may be made out of sapphire glass, but we're still concerned about what this design choice might mean for durability," iFixit writes in their teardown piece.
iPhone 6 Plus camera
(Image: iFixit)
Also new is the vibrator assembly that replaces the old style "motor with an off-set weight" with an electromagnet that vibrates a weight. It's a pretty cool and novel approach to vibrations. I suspect the new design is not only more robust, but allows for a greater range of vibrations.
The power and volume buttons on the new iPhone now feature a rubber gasket that should help with keeping dirt, dust and moisture from making its way inside the handset.
iFixit awarded the iPhone 6 Plus a repairability score of 7 out of 10 (where 10 is the easiest to repair). Praised was the ease of access and how simple screen and battery replacements, and the fact that the fingerprint sensor cable has been rerouted and lengthened (the previous design made tearing the cable easy when opening the handset). However, they criticized the use of proprietary Pentalobe screws and the fact that Apple doesn't share repair information with third-parties.

Monday, April 7, 2014

Qualcomm's SoC Road Map for 2014, 2015

The table in the article below documents Qualcomm direction in response to Apple 64 bit processor (see in September 2013 iPhone 5s Teardown ).

"Today Qualcomm is rounding out its 64-bit family with the Snapdragon 808 and 810. Like the previous 64-bit announcements (Snapdragon 410, 610 and 615), the 808 and 810 leverage ARM's own CPU IP in lieu of a Qualcomm designed microarchitecture. We'll finally hear about Qualcomm's own custom 64-bit architecture later this year, but it's clear that all 64-bit Snapdragon SoCs shipping in 2014 (and early 2015) will use ARM CPU IP."

A key issue for Qualcomm is "Qualcomm's sharing the roadmap to its premium Snapdragon chipset lineup much earlier than it usually does; the 810 and 808 won't be available on devices until the first half of 2015. This is largely due to competitive pressure: MediaTek, Intel and NVIDIA are going big by pushing out chips with 64-bit support and, in some cases, eight cores. Given how fast the industry is iterating, it's not hard to see that Qualcomm -- which currently dominates much of the mobile chipset market -- doesn't want to lose momentum or popularity." Qualcomm's 2015 chips may make you regret getting a new phone this year

See more from September 2013 on iPhone 5s Teardown ,

While Qualcomm grew 31% last year, Media Tek already grew 36% semiconductor vendors ranking - Top Semiconductor Ranking for 2013

Ron

Insightful, timely, and accurate semiconductor consulting.
Semiconductor information and news at - http://www.maltiel-consulting.com/






by Anand Lal Shimpi on April 7, 2014

Today Qualcomm is rounding out its 64-bit family with the Snapdragon 808 and 810. Like the previous 64-bit announcements (Snapdragon 410610 and 615), the 808 and 810 leverage ARM's own CPU IP in lieu of a Qualcomm designed microarchitecture. We'll finally hear about Qualcomm's own custom 64-bit architecture later this year, but it's clear that all 64-bit Snapdragon SoCs shipping in 2014 (and early 2015) will use ARM CPU IP.
While the 410, 610 and 615 all use ARM Cortex A53 cores (simply varying the number of cores and operating frequency), the 808 and 810 move to a big.LITTLE design with a combination of Cortex A53s and Cortex A57s. The latter is an evolution of the Cortex A15, offering anywhere from a 25 - 55% increase in IPC over the A15. The substantial increase in performance comes at around a 20% increase in power consumption at 28nm. Thankfully both the Snapdragon 808 and 810 will be built at 20nm, which should help offset some of the power increase.
Qualcomm's 64-bit Lineup

Snapdragon 810
Snapdragon 808
Snapdragon 615
Snapdragon 610
Snapdragon 410
Internal Model Number
MSM8994
MSM8992
MSM8936
MSM8939
MSM8916
Manufacturing Process
20nm
20nm
28nm LP
28nm LP
28nm LP
CPU
4 x ARM Cortex A57 + 4 x ARM Cortex A53 (big.LITTLE)
2 x ARM Cortex A57 + 4 x ARM Cortex A53 (big.LITTLE)
8 x ARM Cortex A53
4 x ARM Cortex A53
4 x ARM Cortex A53
ISA
32/64-bit ARMv8-A
32/64-bit ARMv8-A
32/64-bit ARMv8-A
32/64-bit ARMv8-A
32/64-bit ARMv8-A
GPU
Adreno 430
Adreno 418
Adreno 405
Adreno 405
Adreno 306
H.265 Decode
Yes
Yes
Yes
Yes
No
H.265 Encode
Yes
No
No
No
No
Memory Interface
2 x 32-bit LPDDR4-1600
2 x 32-bit LPDDR3-933
2 x 32-bit LPDDR3-800
2 x 32-bit LPDDR3-800
2 x 32-bit LPDDR2/3-533
Integrated Modem
9x35 core, LTE Category 6/7, DC-HSPA+, DS-DA
9x35 core, LTE Category 6/7, DC-HSPA+, DS-DA
9x25 core, LTE Category 4, DC-HSPA+, DS-DA
9x25 core, LTE Category 4, DC-HSPA+, DS-DA
9x25 core, LTE Category 4, DC-HSPA+, DS-DA
Integrated WiFi
-
-
Qualcomm VIVE 802.11ac 1-stream
Qualcomm VIVE 802.11ac 1-stream
Qualcomm VIVE 802.11ac 1-stream
eMMC Interface
5.0
5.0
4.5
4.5
4.5
Camera ISP
14-bit dual-ISP
12-bit dual-ISP
?
?
?
Shipping in Devices
1H 2015
1H 2015
Q4 2014
Q4 2014
Q3 2014
The Snapdragon 808 features four Cortex A53s and two Cortex A57s, while the 810 moves to four of each. In both cases all six/eight cores can be active at once (Global Task Scheduling). The designs are divided into two discrete CPU clusters (one for the A53s and one for the A57s). Within a cluster all of the cores have to operate at the same frequency (a change from previous Snapdragon designs), but each cluster can operate at a different frequency (which makes sense given the different frequency targets for these two core types). Qualcomm isn't talking about cache sizes at this point, but I'm guessing we won't see anything as cool/exotic as a large shared cache between the two clusters. Although these are vanilla ARM designs, Qualcomm will be using its own optimized cells and libraries, which may translate into better power/performance compared to a truly off-the-shelf design.
The CPU is only one piece of the puzzle as the rest of the parts of these SoCs get upgraded as well. The Snapdragon 808 will use an Adreno 418 GPU, while the 810 gets an Adreno 430. I have no idea what either of those actually means in terms of architecture unfortunately (Qualcomm remains the sole tier 1 SoC vendor to refuse to publicly disclose meaningful architectural details about its GPUs). In terms of graphics performance, the Adreno 418 is apparently 20% faster than the Adreno 330, and the Adreno 430 is 30% faster than the Adreno 420 (100% faster in GPGPU performance). Note that the Adreno 420 itself is something like 40% faster than Adreno 330, which would make Adreno 430 over 80% faster than the Adreno 330 we have in Snapdragon 800/801 today.
Also on the video side: both SoCs boast dedicated HEVC/H.265 decode hardware. Only the Snapdragon 810 has a hardware HEVC encoder however. The 810 can support up to two 4Kx2K displays (1 x 60Hz + 1 x 30Hz), while the 808 supports a maximum primary display resolution of 2560 x 1600.
The 808/810 also feature upgraded ISPs, although once again details are limited. The 810 gets an upgraded 14-bit dual-ISP design, while the 808 (and below?) still use a 12-bit ISP. Qualcomm claims up to 1.2GPixels/s of throughput, putting ISP clock at 600MHz and offering a 20% increase in ISP throughput compared to the Snapdragon 805.
The Snapdragon 808 features a 64-bit wide LPDDR3-933 interface (1866MHz data rate, 15GB/s memory bandwidth). The 810 on the other hand features a 64-bit wide LPDDR4-1600 interface (3200MHz data rate, 25.6GB/s memory bandwidth). The difference in memory interface prevents the 808 and 810 from being pin-compatible. Despite the similarities otherwise, the 808 and 810 are two distinct pieces of silicon - the 808 isn't a harvested 810.
Both SoCs have a MDM9x35 derived LTE Category 6/7 modem. The SoCs feature essentially the same modem core as a 9x35 discrete modem, but with one exception: Qualcomm enabled support for 3 carrier aggregation LTE (up from 2). The discrete 9x35 modem implementation can aggregate up to two 20MHz LTE carriers in order to reach Cat 6 LTE's 300Mbps peak download rate. The 808/810, on the other hand, can combine up to three 20MHz LTE carriers (although you'll likely see 3x CA used with narrower channels, e.g. 20MHz + 5MHz + 5MHz or 20MHz + 10MHz + 10MHz).
Enabling 3x LTE CA requires two RF transceiver front ends: Qualcomm's WTR3925 and WTR3905. The WTR3925 is a single chip, 2x CA RF transceiver and you need the WTR3905 to add support for combining another carrier. Category 7 LTE is also supported by the hardware (100Mbps uplink), however due to operator readiness Qualcomm will be promoting the design primarily as category 6.
There's no integrated WiFi in either SoC. Qualcomm expects anyone implementing one of these designs to want to opt for a 2-stream, discrete solution such as the QCA6174.

Qualcomm refers to both designs as "multi-billion transistor" chips. I really hope we'll get to the point of actual disclosure of things like die sizes and transistor counts sooner rather than later (the die shot above is inaccurate).
The Snapdragon 808 is going to arrive as a successor to the 800/801, while the 810 sits above it in the stack (with a cost structure similar to the 805). We'll see some "advanced packaging" used in these designs. Both will be available in a PoP configuration, supporting up to 4GB of RAM in a stack. Based on everything above, it's safe to say that these designs are going to be a substantial upgrade over what Qualcomm offers today.
Unlike the rest of the 64-bit Snapdragon family, the 808 and 810 likely won't show up in devices until the first half of 2015 (410 devices will arrive in Q3 2014, while 610/615 will hit in Q4). The 810 will come first (and show up roughly two quarters after the Snapdragon 805, which will show up two quarters after the recently released 801). The 808 will follow shortly thereafter. This likely means we won't see Qualcomm's own 64-bit CPU microarchitecture show up in products until the second half of next year.
With the Snapdragon 808 and 810, Qualcomm rounds out almost all of its 64-bit lineup. The sole exception is the 200 series, but my guess is the pressure to move to 64-bit isn't quite as high down there.
What's interesting to me is just how quickly Qualcomm has shifted from not having any 64-bit silicon on its roadmap to a nearly complete product stack. Qualcomm appeared to stumble a bit after Apple's unexpected 64-bit Cyclone announcement last fall. Leaked roadmaps pointed to a 32-bit only future in 2014 prior to the introduction of Apple's A7. By the end of 2013 however, Qualcomm had quickly added its first 64-bit ARMv8 based SoC to the roadmap (Snapdragon 410). Now here we are, just over six months since the release of iPhone 5s and Qualcomm's 64-bit product stack seems complete. It'll still be roughly a year before all of these products are shipping, but if this was indeed an unexpected detour I really think the big story is just how quickly Qualcomm can move.
I don't know of any other silicon player that can move and ship this quickly. Whatever efficiencies and discipline Qualcomm has internally, I feel like that's the bigger threat to competing SoC vendors, not the modem IP.