Friday, September 21, 2012

iPhone Teardown Updated

Detailed teardown with battery, NAND, A6, DRAM chips views at

More on iPhone 5 Cost $199 BOM

Step 15 ¶

More chips on the underside of the logic board:

Qualcomm PM8018 RF power management IC

Hynix H2JTDG2MBR 128 Gb (16 GB) NAND flash

Apple 338S1131 dialog power management IC*

Apple 338S1117 Elpida memory MCP for LTE*

STMicroelectronics L3G4200D (AGD5/2235/G8SBI ) low-power three-axis gyroscope—same as seen in the iPhone 4S, iPad 2, and other leading smart phones

Murata 339S0171 Wi-Fi module

*Our buddies at Chipworks are making well-informed hypotheses here, and they're pretty good at what they do.
Step 18 ¶

Chips on a board. Kinda like ants on a log.

STMicroelectronics LIS331DLH (2233/DSH/GFGHA) ultra low-power, high performance, three-axis linear accelerometer
Texas Instruments 27C245I touch screen SoC

Broadcom BCM5976 touchscreen controller

Rather than a single touchscreen controller, Apple went with a multi-chip solution to handle the larger screen size, à la iPad.
Apple A6 Application processor
Qualcomm MDM9615M LTE modem
RTR8600 Multi-band/mode RF transceiver, the same one found in the Samsung Galaxy S III

No comments:

Post a Comment