Hynix just announced System in Package (SIP) on a single circuit board by combining 4 stacked DRAM using Through-Silicon Via (TSV) with AMD graphic chip (see below).
Hynix is trying to advance 3D manufacturing using TSV. TSV is essentially advanced packaging manufacturing where holes are drilled through each chip to connect them electrically when they are stacked on top of each other.
More about Through-Silicon Via (TSV) Introduction - 3D Integration & Through Silicon Via(TSV) and The future of computers: 3D chip stacking
While Samsung announced in August 3D NAND using 3D during the chip manufacturing 1Tb SSD: 3D Vertical NAND
Insightful, timely, and accurate semiconductor consulting.
Semiconductor information and news at - http://www.maltiel-consulting.com/