Key new drivers for new semiconductor fabrication tools is advancing FinFETs 20nm to 16nm/14nm with reasonable yield, and the pace of implementation of 3D NAND.
Ramp up of 3D flash manufacturing tools will really happen only in 2016 due to length of the development cycle.
In lithography, multi-patterning will continue to be used while EUV continue to faces difficulties. More details are below.
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