Wednesday, November 12, 2014
Samsung 3D Process Pioneers Next Gen Semiconductor Devices
The basic 3D process could be applied to other technologies beside flash such as DRAM memory or logic. It enable increasing the number of the transistors on each dies without the need to shrink the design rules below 20nm.
It is a key advantages since you do not need to develop the very difficult EUV photolitography.
More about 3D NAND in August 2013 blog - Samsung’s 1Tb SSD: 3D Vertical NAND
It make sense for Samsung to apply 3D Flash first to enterprise SSD, where the growth rate is +40%.
See also Applied Materials development work on advance patterning - Applied Materials Develops Advanced Patterning Solution for Memory Devices
Insightful, timely, and accurate semiconductor consulting.
Semiconductor information and news at - http://www.maltiel-consulting.com/
- See more at: http://www.businesskorea.co.kr/article/7217/focusing-ssds-samsung-mass-produce-3-bit-3d-nand-flash-ssd#sthash.vOPJFbm8.dpuf